BC560 PCBA Inline Cleaning Machine Ultrasonic Cleaner for PCB Board
BC610 PCBA Inline Spray Cleaning Machine Ultrasonic Cleaner for PCB Board
BC620 PCBA Inline Spray Cleaning Machine Ultrasonic Cleaner for PCB Board
BC630 PCBA Inline Spray Cleaning Machine Ultrasonic Cleaner for PCB Board
BC660 PCBA Inline Spray Cleaning Machine Electronic PCB Cleaner
BC680 PCBA Inline Spray Cleaning Machine Electronic PCB Cleaner
FC610 FC Packaging Inline Cleaning Machine for BGA Ball Mount Flux Washing
FC610 is an automated cleaning system designed specifically for the removal of water-soluble flux residues following the BGA solder ball mounting process.
It utilizes a sophisticated four-stage process consisting of heated DI water cleaning, DI water rinsing, air-knife drying, and hot air drying. This comprehensive workflow effectively removes flux residues from both the BGA package and the carrier plate, ensuring a thoroughly clean and dry surface.
FC620 FC Packaging Fully Automatic Inline Cleaning Machine for Chip Semiconductor
FC620 is a high-performance Inline Semiconductor Package Cleaning Machine designed for a wide range of semiconductor packages, including LEADFRAME, IPM, BGA, CSP, and SIP. It is primarily used for the efficient removal of post-soldering flux residues.
It's a PC-based control system and a mesh belt conveyor system, the FC620 utilizes top-and-bottom spray cleaning combined with multi-stage rinsing. As a new-generation, high-precision inline cleaning system, it ensures superior cleaning results and high stability during continuous production.
FC660 FC Packaging Fully Automatic Inline Cleaning Machine for Chip Semiconductor
FC660 is a high-performance Inline Semiconductor Package Cleaning Machine designed specifically for advanced packaging applications including CSP, WLP, PLP, SiP, and FC devices. It is primarily used for the efficient removal of post-soldering flux residues.
It's a PC-based control system and a mesh belt conveyor system, the FC660 utilizes top-and-bottom spray cleaning combined with multi-stage rinsing. As a new-generation, high-precision inline cleaning system, it ensures superior cleaning results and high stability during continuous production.
FC700 FC Packaging Fully Automatic Inline Cleaning Machine for Chip Semiconductor
FC700 is a high-performance Inline Semiconductor Package Cleaning Machine designed specifically for advanced packaging applications including CSP, WLP, PLP, SiP, and FC devices. It is primarily used for the efficient removal of post-soldering flux residues.
It's a PC-based control system and a mesh belt conveyor system, the FC700 utilizes top-and-bottom spray cleaning combined with multi-stage rinsing. As a new-generation, high-precision inline cleaning system, it ensures superior cleaning results and high stability during continuous production.
