BC210 Solder Pallet Cleaning Machine SMT Fixture Cleaner for PCB Assembly Line
BC210 Pallet Cleaner is specially designed for the automatic cleaning of flux residues on the surface of wave soldering pallets.
The equipment adopts a standardized three-stage process: water-based solution cleaning → tap water rinsing → hot air drying. Fully controlled by a PLC program, it supports one-click operation and batch cleaning mode. Boasting excellent compatibility, it is suitable for cleaning wave soldering pallets made of various materials including synthetic stone, glass fiber, stainless steel and alloy.
BC220 Reflow Oven Cooller Condenser Cleaning Machine
BC220 Reflow Oven Condenser Cleaner is designed for the automatic removal of flux residues from condensers, filters, and ventilation racks in lead-free reflow soldering machines. Controlled by a PLC system, it automatically executes a complete cycle of cleaning, rinsing, and hot air drying. This machine ensures thorough cleaning while perfectly protecting the heat sink fins from damage, making it an essential tool for regular maintenance to restore thermal efficiency.
BC410 Squeegee Auto Cleaning Machine SMT Solder Paste Cleaner
The BC410 Squeegee Cleaning Machine features an integrated ultrasonic and spray cleaning system. It follows a standard three-step workflow: washing with water-based solder paste cleaning fluid, rinsing with DI water, and hot air drying. Each batch can clean 6 to 12 squeegees efficiently.
During operation, the squeegees are securely mounted on a special synchronous rotating fixture. This rotating design ensures thorough cleaning of all surfaces, including squeegee gaps, fixture contact areas, and both ends, achieving dead-angle-free cleaning. The result is complete removal of solder paste residues, restoring the squeegees' accuracy for immediate reuse in production.
BC420 Customized Cleaning Machine for Automatic Solder Paste Feeding Device
The BC420 is professionally designed to clean automatic solder paste feeding devices.
During operation, the automatic solder paste feeding device is fixed onto a rotating bracket inside the cleaning chamber, which keeps rotating throughout the process.
Combining the physical force of ultrasonic vibration and high-pressure spraying, together with the chemical dissolving power of water-based solder paste cleaning solution, the BC420 decomposes and removes residual solder paste from surfaces, corners and narrow gaps of the feeding device until thoroughly clean.
After cleaning, rinse the unit with DI water or purified tap water, followed by hot air drying to completely eliminate remaining moisture on the device.
