BC210 Solder Pallet Cleaning Machine SMT Fixture Cleaner for PCB Assembly Line
BC210 Pallet Cleaner is specially designed for the automatic cleaning of flux residues on the surface of wave soldering pallets.
The equipment adopts a standardized three-stage process: water-based solution cleaning → tap water rinsing → hot air drying. Fully controlled by a PLC program, it supports one-click operation and batch cleaning mode. Boasting excellent compatibility, it is suitable for cleaning wave soldering pallets made of various materials including synthetic stone, glass fiber, stainless steel and alloy.
BC310D Pneumatic SMT Stencil Cleaner with 2 Chambers for SMT PCB Assembly Solder Paste Stencil Cleaning
The BC310D Pneumatic Dual-Stencil Cleaner is designed for the automatic cleaning of solder paste stencils and red glue stencils in SMT processes. Selected high-quality pneumatic components and stringent manufacturing processes are adopted to ensure the excellent quality and stable operation of the whole machine from the source. Equipped with a user-friendly one-key operation mode, it automatically completes the entire process of cleaning and drying, achieving high efficiency and convenience. The machine is configured with two independent cleaning systems, which can clean two stencils simultaneously without mutual interference, greatly improving the cleaning efficiency of the production line.
BC320 Electric SMT Stencil Cleaning Machine for PCB Assembly Solder Paste Stencil Washing
BC320 Stencil Cleaner is suitable for cleaning solder paste stencils, red glue stencils, red glue copper stencils and red glue resin stencils in SMT processes, and can also realize automatic cleaning of misprinted PCBs and PCBAs.
The equipment adopts a three-stage processing procedure of spray cleaning + DI water rinsing + hot air drying, using water-based cleaning fluid throughout the process for excellent environmental friendliness and cleaning performance. During the cleaning process, the stencil is driven by a motor to move back and forth at a constant speed, while the spray rods and air knives on both sides remain stationary. Through the efficient coordination of dynamic cleaning and static spraying, it fully ensures the stability and reliability of equipment operation, as well as the high cleanliness of stencils after cleaning.
BC610 Fully Automatic Inline PCBA Cleaning Machine for Large Batch SMT Assembly Lines Deflux
BC610 is ideal for large batches PCBA cleaning. It adopts inline cleaning system with a sectional upper and lower spray cleaning method, through the process of chemical fluid cleaning + DI water rinsing + hot air drying, can completely removes rosin flux, no-clean flux and water-soluble flux residues on SMT or THT PCBA after welding. It's used in industries such as automotive electronics, aerospace, communications, medical, MiniLED, and smart instrumentation.
BC680 Fully Automatic Inline PCBA Cleaning Machine for Large Batch SMT Assembly Lines Deflux
BC680 is ideal for large batches PCBA cleaning. It adopts inline cleaning system with a sectional upper and lower spray cleaning method, through the process of chemical fluid cleaning + DI water rinsing + hot air drying, can completely removes rosin, flux residue and solder paste residues on SMT or THT PCBA after welding. It's used in industries such as automotive electronics, aerospace, communications, medical, MiniLED, and smart instrumentation.
DI-1000 Deionized Water Supply Machine Automatic Water Purifier RO DI Water for Cleaning Production
DI-1000 is used to turn tap water into DI water and supply to our PCBA batch type cleaning machine for DI water rinse after liquid cleaning. It consists of three main components: pre-treatment system, RO reverse osmosis system, and MB mixed bed system. The equipment features easy operation, stable performance, and fully automatic operation, ensuring high effluent resistivity.
FC610 BGA Inline Cleaning Machine for high-reliability PCB Assemblies
FC610 is an automated cleaning system designed specifically for the removal of water-soluble flux residues following the BGA solder ball mounting process.
It utilizes a sophisticated four-stage process consisting of heated DI water cleaning, DI water rinsing, air-knife drying, and hot air drying. This comprehensive workflow effectively removes flux residues from both the BGA package and the carrier plate, ensuring a thoroughly clean and dry surface.
FC700 Inline Cleaning Machine PCBA Cleaner
FC700 is a high-performance Inline Semiconductor Package Cleaning Machine designed specifically for advanced packaging applications including CSP, WLP, PLP, SiP, and FC devices. It is primarily used for the efficient removal of post-soldering flux residues.
It's a PC-based control system and a mesh belt conveyor system, the FC700 utilizes top-and-bottom spray cleaning combined with multi-stage rinsing. As a new-generation, high-precision inline cleaning system, it ensures superior cleaning results and high stability during continuous production.
