AC620 OfflinePCBA Cleaning Machine for SIP BGA CSP QFN Flux Residue Removal
The SPERTAR AC620 cleaning machine is specially designed for automatic cleaning of flux residues under SIP modules, as well as beneath PCBA boards assembled with precision components such as BGA, CSP and QFN. It meets the cleaning requirements of all types of solder flux.
The AC620 adopts the process of water-based detergent cleaning, DI water rinsing and hot air drying.
It features an ultra-stable structural design: during operation, the PCBA products move back and forth with fixtures, while spray bars and air knives remain stationary. This keeps the pressure of cleaning and rinsing spraying stable, ensuring constant operating temperature of the equipment and high-quality cleaning results in daily use.
The AC620 applies vertical spraying cleaning, which is perfectly suitable for flux cleaning of PCBs with fine-pitch components and flip-chip devices.
Equipped with dual tracks and two complete sets of cleaning zones on the left and right sides, each cleaning zone contains 4 high-pressure cleaning spray bars and 4 professional drying air knives. It can process two rows of products simultaneously, effectively doubling the production capacity.
AC630 OfflinePCBA Cleaning Machine for SIP BGA CSP QFN Flux Residue Removal
The SPERTAR AC630 cleaning machine is specially designed for automatic cleaning of flux residues under SIP modules, as well as beneath PCBA boards assembled with precision components such as BGA, CSP and QFN. It meets the cleaning requirements of all types of solder flux.
The AC630 adopts the process of water-based detergent cleaning, DI water rinsing and hot air drying.
It features an ultra-stable structural design: during operation, the PCBA products move back and forth with fixtures, while spray bars and air knives remain stationary. This keeps the pressure of cleaning and rinsing spraying stable, ensuring constant operating temperature of the equipment and high-quality cleaning results in daily use.
The AC630 applies vertical spraying cleaning, which is perfectly suitable for flux cleaning of PCBs with fine-pitch components and flip-chip devices.
Equipped with dual tracks and two complete sets of cleaning zones on the left and right sides, each cleaning zone contains 4 high-pressure cleaning spray bars and 4 professional drying air knives. It can process two rows of products simultaneously, effectively doubling the production capacity.
FC610 BGA Inline Cleaning Machine for high-reliability PCB Assemblies
FC610 is an automated cleaning system designed specifically for the removal of water-soluble flux residues following the BGA solder ball mounting process.
It utilizes a sophisticated four-stage process consisting of heated DI water cleaning, DI water rinsing, air-knife drying, and hot air drying. This comprehensive workflow effectively removes flux residues from both the BGA package and the carrier plate, ensuring a thoroughly clean and dry surface.
