The BC310 Pneumatic Stencil Cleaner is specially designed for the automatic cleaning of solder paste stencils and red glue stencils in SMT processes. It is compatible with both water-based cleaning fluids and solvents, catering to the requirements of different production scenarios.
Selected high-quality pneumatic components are adopted for the equipment, combined with stringent manufacturing processes. This ensures high quality and operational stability of the whole machine from the source, continuously empowering the production line. Featured with a user-friendly one-key operation process, it enables automatic connection of cleaning and drying procedures, greatly simplifying operation steps and improving production efficiency.
Meanwhile, equipped with a specially designed spray rod rotating mechanism, coupled with a high-flow and high-pressure cleaning mode, it can fully cover the stencil gaps, powerfully remove residual stains, ensure stencil cleaning cleanliness, and facilitate the accurate and efficient implementation of subsequent printing processes.
The BC310D Pneumatic Dual-Stencil Cleaner is designed for the automatic cleaning of solder paste stencils and red glue stencils in SMT processes. Selected high-quality pneumatic components and stringent manufacturing processes are adopted to ensure the excellent quality and stable operation of the whole machine from the source. Equipped with a user-friendly one-key operation mode, it automatically completes the entire process of cleaning and drying, achieving high efficiency and convenience. The machine is configured with two independent cleaning systems, which can clean two stencils simultaneously without mutual interference, greatly improving the cleaning efficiency of the production line.
BC320 Stencil Cleaner is suitable for cleaning solder paste stencils, red glue stencils, red glue copper stencils and red glue resin stencils in SMT processes, and can also realize automatic cleaning of misprinted PCBs and PCBAs.
The equipment adopts a three-stage processing procedure of spray cleaning + DI water rinsing + hot air drying, using water-based cleaning fluid throughout the process for excellent environmental friendliness and cleaning performance. During the cleaning process, the stencil is driven by a motor to move back and forth at a constant speed, while the spray rods and air knives on both sides remain stationary. Through the efficient coordination of dynamic cleaning and static spraying, it fully ensures the stability and reliability of equipment operation, as well as the high cleanliness of stencils after cleaning.
BC210 Pallet Cleaner is specially designed for the automatic cleaning of flux residues on the surface of wave soldering pallets.
The equipment adopts a standardized three-stage process: water-based solution cleaning → tap water rinsing → hot air drying. Fully controlled by a PLC program, it supports one-click operation and batch cleaning mode. Boasting excellent compatibility, it is suitable for cleaning wave soldering pallets made of various materials including synthetic stone, glass fiber, stainless steel and alloy.
BC220 Reflow Oven Condenser Cleaner is designed for the automatic removal of flux residues from condensers, filters, and ventilation racks in lead-free reflow soldering machines. Controlled by a PLC system, it automatically executes a complete cycle of cleaning, rinsing, and hot air drying. This machine ensures thorough cleaning while perfectly protecting the heat sink fins from damage, making it an essential tool for regular maintenance to restore thermal efficiency.
The BC410 Squeegee Cleaning Machine features an integrated ultrasonic and spray cleaning system. It follows a standard three-step workflow: washing with water-based solder paste cleaning fluid, rinsing with DI water, and hot air drying. Each batch can clean 6 to 12 squeegees efficiently.
During operation, the squeegees are securely mounted on a special synchronous rotating fixture. This rotating design ensures thorough cleaning of all surfaces, including squeegee gaps, fixture contact areas, and both ends, achieving dead-angle-free cleaning. The result is complete removal of solder paste residues, restoring the squeegees' accuracy for immediate reuse in production.
The BC420 is professionally designed to clean automatic solder paste feeding devices.
During operation, the automatic solder paste feeding device is fixed onto a rotating bracket inside the cleaning chamber, which keeps rotating throughout the process.
Combining the physical force of ultrasonic vibration and high-pressure spraying, together with the chemical dissolving power of water-based solder paste cleaning solution, the BC420 decomposes and removes residual solder paste from surfaces, corners and narrow gaps of the feeding device until thoroughly clean.
After cleaning, rinse the unit with DI water or purified tap water, followed by hot air drying to completely eliminate remaining moisture on the device.
BC30 Nozzle Cleaning Machine adopts a multi-nozzle atomized water jet cleaning method to thoroughly remove residual solder paste from nozzles. The equipment features fully automatic cleaning, capable of processing 30 nozzles per cycle. Different nozzle models are matched with corresponding fixture trays, enabling compatibility with nozzles of all placement machine models. After cleaning, the nozzles are automatically dried with compressed air.
The Spertar AC530 offline PCBA deflux cleaning machine is ideal for multi-type PCBA cleaning in small to medium batch production. It adopts a full-process design with chemical cleaning solution washing, DI water rinsing and hot air drying. All procedures are completed inside a single integrated cleaning chamber. Featuring a compact footprint and high integration structure, this unit thoroughly removes rosin-based flux, no-clean flux, water-soluble flux residues from welded SMT and THT PCBA boards. It ensures all cleaned PCBA assemblies fully meet industrial high cleanliness standards.
Spertar AC510 offline PCBA deflux cleaner suits multi-type, small and medium batch PCBA cleaning. With chemical washing, DI water rinsing and hot air drying in one compact chamber, it fully eliminates all kinds of flux residues on SMT/THT PCBA to reach standard industrial cleanliness.
BC560 is a fully automatic inline DI water cleaning machine for PCBA. It is suitable for large batches cleaning of water-soluble flux residues on PCBA and widely used in industries including automotive electronics, aerospace, medical, MINILED, and smart instrumentation.
BC620 is a high-efficiency inline, fully automatic PCBA cleaning machine that can remove water-soluble flux from PCBA. It is used in industries such as automotive electronics, aerospace, medical, MINILED, and smart instrumentation.
BC610 is ideal for large batches PCBA cleaning. It adopts inline cleaning system with a sectional upper and lower spray cleaning method, through the process of chemical fluid cleaning + DI water rinsing + hot air drying, can completely removes rosin flux, no-clean flux and water-soluble flux residues on SMT or THT PCBA after welding. It's used in industries such as automotive electronics, aerospace, communications, medical, MiniLED, and smart instrumentation.
BC630 is ideal for large batches PCBA cleaning. It adopts inline cleaning system with a sectional upper and lower spray cleaning method, through the process of chemical fluid cleaning + DI water rinsing + hot air drying, can completely removes rosin, flux residue and solder paste residues on SMT or THT PCBA after welding. It's used in industries such as automotive electronics, aerospace, communications, medical, MiniLED, and smart instrumentation.
BC660 is ideal for large batches PCBA cleaning. It adopts inline cleaning system with a sectional upper and lower spray cleaning method, through the process of chemical fluid cleaning + DI water rinsing + hot air drying, can completely removes rosin, flux residue and solder paste residues on SMT or THT PCBA after welding. It's used in industries such as automotive electronics, aerospace, communications, medical, MiniLED, and smart instrumentation.
BC680 is ideal for large batches PCBA cleaning. It adopts inline cleaning system with a sectional upper and lower spray cleaning method, through the process of chemical fluid cleaning + DI water rinsing + hot air drying, can completely removes rosin, flux residue and solder paste residues on SMT or THT PCBA after welding. It's used in industries such as automotive electronics, aerospace, communications, medical, MiniLED, and smart instrumentation.
FC610 is an automated cleaning system designed specifically for the removal of water-soluble flux residues following the BGA solder ball mounting process.
It utilizes a sophisticated four-stage process consisting of heated DI water cleaning, DI water rinsing, air-knife drying, and hot air drying. This comprehensive workflow effectively removes flux residues from both the BGA package and the carrier plate, ensuring a thoroughly clean and dry surface.
FC620 is a high-performance Inline Semiconductor Package Cleaning Machine designed for a wide range of semiconductor packages, including LEADFRAME, IPM, BGA, CSP, and SIP. It is primarily used for the efficient removal of post-soldering flux residues.
It's a PC-based control system and a mesh belt conveyor system, the FC620 utilizes top-and-bottom spray cleaning combined with multi-stage rinsing. As a new-generation, high-precision inline cleaning system, it ensures superior cleaning results and high stability during continuous production.
FC660 is a high-performance Inline Semiconductor Package Cleaning Machine designed specifically for advanced packaging applications including CSP, WLP, PLP, SiP, and FC devices. It is primarily used for the efficient removal of post-soldering flux residues.
It's a PC-based control system and a mesh belt conveyor system, the FC660 utilizes top-and-bottom spray cleaning combined with multi-stage rinsing. As a new-generation, high-precision inline cleaning system, it ensures superior cleaning results and high stability during continuous production.
FC700 is a high-performance Inline Semiconductor Package Cleaning Machine designed specifically for advanced packaging applications including CSP, WLP, PLP, SiP, and FC devices. It is primarily used for the efficient removal of post-soldering flux residues.
It's a PC-based control system and a mesh belt conveyor system, the FC700 utilizes top-and-bottom spray cleaning combined with multi-stage rinsing. As a new-generation, high-precision inline cleaning system, it ensures superior cleaning results and high stability during continuous production.