Products

UC-250BV removes dust, fibers, and metal particles from PCB pads inline before printing. It guarantees a contaminant-free surface to eliminate soldering defects and maximize yield.

UC-250M-C integrates two distinct cleaning mechanisms: "Rotary Brush + Vacuum" and "Sticky Roller + Tack Roll." The system offers flexible operation modes, allowing both functions to run simultaneously or independently based on specific process requirements. Brush Cleaning System: Effectively removes particulates and larger foreign debris from the PCB surface. Roller Cleaning System: Targets micro-dust and electrostatically adsorbed particles for deep cleaning.