The FC760S is a substrate inline cleaning machine designed for cleaning advanced packaging substrates, it adopting PC+PLC control system and stainless steel mesh conveyor, and dual-side spray washing/rinsing to remove flux residues efficiently.
UC-250BV removes dust, fibers, and metal particles from PCB pads inline before printing. It guarantees a contaminant-free surface to eliminate soldering defects and maximize yield.
UC-250M-C integrates two distinct cleaning mechanisms: "Rotary Brush + Vacuum" and "Sticky Roller + Tack Roll." The system offers flexible operation modes, allowing both functions to run simultaneously or independently based on specific process requirements.
Brush Cleaning System: Effectively removes particulates and larger foreign debris from the PCB surface.
Roller Cleaning System: Targets micro-dust and electrostatically adsorbed particles for deep cleaning.