Semicon package cleaning machine is a crucial component of semiconductor packaging equipment, designed to remove the flux, particles, organic substances, etc from the surfaces of chips, packaging substrates or related devices, ensuring the performance and yield of products.
I. Cleaning Types and Application Scenarios
Classified by Cleaning Objects
- Chip packaging cleaning : Targeted at chips or substrates in the packaging process, such as the cleaning of flux residues after processes like FC, WLP, SIP and CSP.
- Wafer/FOUP cleaning : Used to clean wafer transfer containers and avoid wafer contamination.
- PCBA cleaning: Aimed at the cleaning of post-welding residues on packaging substrates (e.g., IC substrates, Mini-LEDs, etc.).
Classified by Cleaning Methods
- Spray cleaning: Achieves high-efficiency cleaning through upper and lower spraying, suitable for mass inline production (e.g., FC700 cleaning machine).
- Ultrasonic cleaning: Removes micro-particles by utilizing the cavitation effect, commonly used for precision components.
- Chemical wet cleaning: Dissolves contaminants with acidic or alkaline solutions, which needs to be combined with rinsing and drying processes.
- Plasma cleaning: Applied to remove organic contaminants or activate surfaces, typically used in high-end manufacturing processes.
II. Core Functions and Technical Features
Key Process Steps
- Pre-cleaning: Initial removal of loose contaminants;
- Main cleaning: In-depth cleaning via chemical solutions or spray systems;
- Rinsing: Flushing away residual chemicals with DI water (deionized water);
- Drying: Hot air circulation, air knife water cutting or infrared drying to prevent water stain residues.
Technical Highlights
High-precision Control
- Adjustable spray pressure and flow rate (e.g., the FC700 cleaning machine enables cleaning fluid to penetrate to the bottom of chips);
- Real-time monitoring of temperature and resistivity (of DI water) to ensure cleaning consistency.
Automation and Intellectualization
- PLC or PC control systems supporting program storage and recall;
- Compatible with automatic transmission lines and capable of interconnection with upstream and downstream equipment (e.g., inline cleaning systems).
Material and Structural Design
- Corrosion-resistant materials SUS304 stainless steel to adapt to acidic/alkaline cleaning fluids;
- Filtration systems to ensure the cleanliness of cleaning fluids.
Environmental Protection and Safety
- Wastewater treatment system: Discharge after neutralization treatment in compliance with environmental protection standards;
- Sealed cavity design: Reduces chemical volatilization and is equipped with a ventilation system (e.g., the air volume of FC700 is 42 cubic meters per hour).
III. Typical Equipment Examples
FC700 Inline Cleaning machine
Application scenario: Cleaning of flux residues after packaging processes such as CSP, WLP and SiP.
Features:
- A complete process consisting of 3-stage chemical cleaning, 3-stage DI water rinsing and hot air drying;
- High-flow spraying for cleaning fluid to cover the bottom of chips;
- Support for automatic addition of cleaning fluid and DI water, with real-time inline resistivity monitoring.
PCBA Inline Cleaning machine
Application scenario: Cleaning of packaging substrates in aerospace, medical, automotive and other fields.
Features:
- Integrated completion of chemical cleaning, rinsing and drying;
- SUS304 stainless steel body with acid and alkali corrosion resistance;
- Four air knives combined with infrared drying to improve drying efficiency.
IV. Industry Trends and Challenges
Technological Trends
- Higher precision: For advanced packaging (e.g., 3D IC, Chiplet), it is necessary to improve the particle removal capability (e.g., for particles smaller than 10nm);
- Green cleaning: Promote fluorine-free environmentally friendly cleaning fluids to reduce chemical pollution;
- Intelligent integration: Combine with AI to realize adaptive optimization of cleaning parameters.
Faced Challenges
- Complexification of contaminants: New packaging materials (e.g., low-temperature solder, temporary bonding adhesive) impose higher requirements on the matching of cleaning fluids;
- Cost control: High costs of high-purity DI water, chemical fluid consumption and waste liquid treatment;
- Equipment compatibility: Need to adapt to the differentiated requirements of diverse packaging processes (e.g., FC, WLP, SIP).
Semiconductor cleaning machine play an indispensable role in the packaging process, and their technological development needs to balance cleaning effect, production efficiency and environmental protection requirements.
In the future, with the popularization of advanced packaging technologies, cleaning equipment will evolve towards higher precision, intellectualization and greenization. Meanwhile, attention should be paid to the compatibility with new materials and cost optimization. Enterprises can select suitable cleaning solutions (e.g.inline spray cleaning) according to their own needs, and conduct regular equipment maintenance to ensure long-term stability.
Spertar is a leading precision cleaning equipment manufacturer based in China. We provide not only PCBA cleaner, SMT cleaner, but also FC Semicon Packaging Fully Automatic Inline Cleaning Machine for Flip Chip SIP/BGA/SCP. Contact us today to customize your ideal cleaning solution.
