In Surface Mount Technology (SMT), the BGA full name Ball Grid Array.
BGA is an advanced packaging technology commonly used in high-performance, highly integrated chips. It’s core component in all kinds of high-end electronic devices.
Unlike the traditional exposed pins chips, BGA chip are a row of solder balls distributed at the bottom, this can greatly increase the number of pins to meet the CPU GPU high-end communication chip signal transmission requirements.
At the same time, the solder ball can also help the chip dissipate heat, make the operation more stable.
In the PCB assembly process, BGA needs to bematched with SMT process, complete welding through solder paste, surface mount machine and reflow oven.
Its concealed pin design significantly reduced electromagnetic interference. It also reduces the chip footprint, making electronic devices become thinner and lighter highly. And widely used in server smartphones industrial control motherboard and other high-end areas.
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