BC630 PCBA Inline Spray Cleaning Machine Ultrasonic Cleaner for PCB Board

BC630 is an inline, fully automatic PCBA cleaning machine that can remove rosin flux, no-clean flux, and water-soluble flux from PCBA. It is used in industries such as automotive electronics, aerospace, communications, medical, MiniLED, and smart instrumentation.

BC660 PCBA Inline Spray Cleaning Machine Electronic PCB Cleaner

BC660 is an inline PCBA cleaning machine with an extended cleaning section, to automatic remove rosin flux, no-clean flux, and water-soluble flux from PCBA. It is used in industries such as automotive electronics, aerospace, communications, medical, MiniLED, and smart instrumentation.

BC680 PCBA Inline Spray Cleaning Machine Electronic PCB Cleaner

BC680 is an inline PCBA cleaning machine with an extended cleaning section, to automatic remove rosin flux, no-clean flux, and water-soluble flux from PCBA. It is used in industries such as automotive electronics, aerospace, communications, medical, MiniLED, and smart instrumentation.

DI-1000 Deionized Water Supply Machine Automatic Water Purifier RO DI Water for Cleaning Production

DI-1000 is used to turn tap water into DI water and supply to our PCBA batch type cleaning machine for DI water rinse after liquid cleaning. It consists of three main components: pre-treatment system, RO reverse osmosis system, and MB mixed bed system. The equipment features easy operation, stable performance, and fully automatic operation, ensuring high effluent resistivity.

DI-200 Deionized Water Supply Machine Automatic Water Purifier RO DI Water for Cleaning Production

DI200  is used to turn tap water into DI water and supply to our PCBA batch type cleaning machine for DI water rinse after liquid cleaning. It consists of three main components: pre-treatment system, RO reverse osmosis system, and MB mixed bed system. The equipment features easy operation, stable performance, and fully automatic operation, ensuring high effluent resistivity.

FC610 FC Packaging Inline Cleaning Machine for BGA Ball Mount Flux Washing

FC610 is an automated cleaning system designed specifically for the removal of water-soluble flux residues following the BGA solder ball mounting process. It utilizes a sophisticated four-stage process consisting of heated DI water cleaning, DI water rinsing, air-knife drying, and hot air drying. This comprehensive workflow effectively removes flux residues from both the BGA package and the carrier plate, ensuring a thoroughly clean and dry surface.

FC620 FC Packaging Fully Automatic Inline Cleaning Machine for Chip Semiconductor

FC620 is a high-performance Inline Semiconductor Package Cleaning Machine designed for a wide range of semiconductor packages, including LEADFRAME, IPM, BGA, CSP, and SIP. It is primarily used for the efficient removal of post-soldering flux residues. It's a PC-based control system and a mesh belt conveyor system, the FC620 utilizes top-and-bottom spray cleaning combined with multi-stage rinsing. As a new-generation, high-precision inline cleaning system, it ensures superior cleaning results and high stability during continuous production.

FC660 FC Packaging Fully Automatic Inline Cleaning Machine for Chip Semiconductor

FC660 is a high-performance Inline Semiconductor Package Cleaning Machine designed specifically for advanced packaging applications including CSP, WLP, PLP, SiP, and FC devices. It is primarily used for the efficient removal of post-soldering flux residues. It's a PC-based control system and a mesh belt conveyor system, the FC660 utilizes top-and-bottom spray cleaning combined with multi-stage rinsing. As a new-generation, high-precision inline cleaning system, it ensures superior cleaning results and high stability during continuous production.

FC700 FC Packaging Fully Automatic Inline Cleaning Machine for Chip Semiconductor

FC700 is a high-performance Inline Semiconductor Package Cleaning Machine designed specifically for advanced packaging applications including CSP, WLP, PLP, SiP, and FC devices. It is primarily used for the efficient removal of post-soldering flux residues. It's a PC-based control system and a mesh belt conveyor system, the FC700 utilizes top-and-bottom spray cleaning combined with multi-stage rinsing. As a new-generation, high-precision inline cleaning system, it ensures superior cleaning results and high stability during continuous production.

UC-250BV SMT PCB Surface Cleaning Machine

UC-250BV removes dust, fibers, and metal particles from PCB pads inline before printing. It guarantees a contaminant-free surface to eliminate soldering defects and maximize yield.

UC-250M-CV SMT PCB Surface Cleaning Machine

UC-250M-C integrates two distinct cleaning mechanisms: "Rotary Brush + Vacuum" and "Sticky Roller + Tack Roll." The system offers flexible operation modes, allowing both functions to run simultaneously or independently based on specific process requirements. Brush Cleaning System: Effectively removes particulates and larger foreign debris from the PCB surface. Roller Cleaning System: Targets micro-dust and electrostatically adsorbed particles for deep cleaning.