FC620 FC Packaging Fully Automatic Inline Cleaning Machine for Chip Semiconductor

The BC310 Pneumatic Stencil Cleaner is specially designed for the automatic cleaning of solder paste stencils and red glue stencils in SMT processes. It is compatible with both water-based cleaning fluids and solvents, catering to the requirements of different production scenarios. Selected high-quality pneumatic components are adopted for the equipment, combined with stringent manufacturing processes. This ensures high quality and operational stability of the whole machine from the source, continuously empowering the production line. Featured with a user-friendly one-key operation process, it enables automatic connection of cleaning and drying procedures, greatly simplifying operation steps and improving production efficiency. Meanwhile, equipped with a specially designed spray rod rotating mechanism, coupled with a high-flow and high-pressure cleaning mode, it can fully cover the stencil gaps, powerfully remove residual stains, ensure stencil cleaning cleanliness, and facilitate the accurate and efficient implementation of subsequent printing processes.  

BC320 Stencil Cleaner is suitable for cleaning solder paste stencils, red glue stencils, red glue copper stencils and red glue resin stencils in SMT processes, and can also realize automatic cleaning of misprinted PCBs and PCBAs. The equipment adopts a three-stage processing procedure of spray cleaning + DI water rinsing + hot air drying, using water-based cleaning fluid throughout the process for excellent environmental friendliness and cleaning performance. During the cleaning process, the stencil is driven by a motor to move back and forth at a constant speed, while the spray rods and air knives on both sides remain stationary. Through the efficient coordination of dynamic cleaning and static spraying, it fully ensures the stability and reliability of equipment operation, as well as the high cleanliness of stencils after cleaning.