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FC610 In-line cleaning machine mixed spray technology PCB cleaner

FC610 BGA Inline Cleaning Machine for high-reliability PCB Assemblies

FC610 is an automated cleaning system designed specifically for the removal of water-soluble flux residues following the BGA solder ball mounting process. It utilizes a sophisticated four-stage process consisting of heated DI water cleaning, DI water rinsing, air-knife drying, and hot air drying. This comprehensive workflow effectively removes flux residues from both the BGA package and the carrier plate, ensuring a thoroughly clean and dry surface.
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FC610 In-line cleaning machine mixed spray technology PCB cleaner

FC620 Inline Cleaning Machine PCBA Cleaner

FC620 is a high-performance Inline Semiconductor Package Cleaning Machine designed for a wide range of semiconductor packages, including LEADFRAME, IPM, BGA, CSP, and SIP. It is primarily used for the efficient removal of post-soldering flux residues. It's a PC-based control system and a mesh belt conveyor system, the FC620 utilizes top-and-bottom spray cleaning combined with multi-stage rinsing. As a new-generation, high-precision inline cleaning system, it ensures superior cleaning results and high stability during continuous production.
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FC660 Inline Cleaning Machine PCBA Cleaner

FC660 Inline Cleaning Machine PCBA Cleaner

FC660 is a high-performance Inline Semiconductor Package Cleaning Machine designed specifically for advanced packaging applications including CSP, WLP, PLP, SiP, and FC devices. It is primarily used for the efficient removal of post-soldering flux residues. It's a PC-based control system and a mesh belt conveyor system, the FC660 utilizes top-and-bottom spray cleaning combined with multi-stage rinsing. As a new-generation, high-precision inline cleaning system, it ensures superior cleaning results and high stability during continuous production.
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FC700 Inline Cleaning Machine PCBA Cleaner for high-reliability PCB

FC700 Inline Cleaning Machine PCBA Cleaner

FC700 is a high-performance Inline Semiconductor Package Cleaning Machine designed specifically for advanced packaging applications including CSP, WLP, PLP, SiP, and FC devices. It is primarily used for the efficient removal of post-soldering flux residues. It's a PC-based control system and a mesh belt conveyor system, the FC700 utilizes top-and-bottom spray cleaning combined with multi-stage rinsing. As a new-generation, high-precision inline cleaning system, it ensures superior cleaning results and high stability during continuous production.
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Spertar fc820 inline cleaning machine for large SIP modules
FC820 inline cleaning system PCB cleaner application for SIP module semiconductor packaging

Inline Cleaning Machine for Lower Standoff Heights SIP Modules | Automatic Online PCB Cleaner FC820

FC820 is a professional inline cleaning system for larg die sizes and low standoff heights SIP modular. Featuring long chemical wash/rinse sections, adjustable spray system, chemical recovery and full intelligent monitoring, it delivers high-precision precision SIP modules below 50 µm.

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High-performance inline cleaning system for FCBGA, FCCSP, and 2.5D/3D IC packaging. Removes flux residues in low-gap structures with precision and stability.

Inline Cleaning System for FCBGA, FCCSP & 2.5D/3D Packaging | Automatic Online PCB Cleaner FC800

The FC800 Inline Cleaning System is a high-performance semiconductor cleaning solution designed for advanced packaging processes, including FCBGA, FCCSP, and 2.5D/3D IC technologies.

Engineered to address the challenges of ultra-low standoff components and high-density packaging, the FC800 delivers precise and reliable removal of flux residues from complex assemblies. Its advanced spray system and optimized nozzle configuration ensure effective cleaning under fine-pitch devices and narrow gaps.

With intelligent PC+PLC control and a Windows-based operation interface, the system offers stable, automated, and user-friendly performance in high-volume production environments.

The integrated chemical management system, including real-time monitoring, auto compensation, and vapor recovery, significantly reduces operational costs while maintaining consistent cleaning quality.

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FC760 automatic FCBGA FCCSP SIP flux inline cleaning system for semiconductor advanced packaging

Inline Cleaning System for FCBGA, FCCSP & SIP Flux Removal | Automatic PCBA Cleaner FC760

The FC760 Inline Cleaning System is engineered for high‑precision flux removal in FCBGA, FCCSP, and SIP module manufacturing. As advanced packaging technologies continue to shrink component gaps and increase I/O density, the FC760 delivers the cleaning performance required to maintain high yield and reliability in modern semiconductor packaging assembly lines.

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