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Home SEMI Packaging Cleaning Machine FC660 FC Packaging Fully Automatic Inline Cleaning Machine for Chip Semiconductor
FC620 FC Packaging Fully Automatic Inline Cleaning Machine for Chip Semiconductor
FC620 FC Packaging Fully Automatic Inline Cleaning Machine for Chip Semiconductor
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FC700 FC Packaging Fully Automatic Inline Cleaning Machine for Chip Semiconductor
FC700 FC Packaging Fully Automatic Inline Cleaning Machine for Chip Semiconductor

FC660 FC Packaging Fully Automatic Inline Cleaning Machine for Chip Semiconductor

FC660 is a high-performance Inline Semiconductor Package Cleaning Machine designed specifically for advanced packaging applications including CSP, WLP, PLP, SiP, and FC devices. It is primarily used for the efficient removal of post-soldering flux residues.
It’s a PC-based control system and a mesh belt conveyor system, the FC660 utilizes top-and-bottom spray cleaning combined with multi-stage rinsing. As a new-generation, high-precision inline cleaning system, it ensures superior cleaning results and high stability during continuous production.

Categories: Inline Cleaning Machine, SEMI Packaging Cleaning Machine Tags: Batch cleaning, BGA-Ball Grid Array, Conveyor cleaning, DI water spraying, FC Semi Packaging, FC-Flip Chip, High Pressure Clean, inline cleaning machine, Semiconductor Packaging, Spray Washing, Ultrasonic Electronic, Water-based Cleaning
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  • Description
Description

Features

SUS304 Stainless Steel: High rigidity, temperature/acid-alkali resistance, leak-proof.

High-Volume Inline System: For mass cleaning of packaged chips.

Spray Cleaning: Efficiently removes flux and organic/inorganic contaminants.

Workflow: chemical cleaning + multi-stage DI rinsing + extended hot air drying.

Auto Refill: Cleaning fluid and DI water auto-replenished.

Adjustable Parameters: Cleaning, rinsing, chemical isolation, air-knife pressure.

High-Pressure & Flow: Superior cleaning performance.

DI Water Monitoring: Equipped with rinsing water resistivity monitor.

Control System: PC-based, bilingual (CN/EN) GUI.

Integration & Options: Connectable to form auto line; optional SECS/GEM, chemical concentration detection & auto-compensation.

Specification document

Item Basic Specifications
Conveyor Belt Width 600 mm
Conveyor Speed 0.1~1.5 m/min
Conveyor Height 900 ± 50 mm
Conveyor Direction Left to Right
Cleaning Height 50 mm
Cleaning/Rinsing Tank Capacity 320 L / 140L
Filtration 1µm
DI Water Consumption 400~1000 L/H
Air Exhaust Volume 42 m³/H
Control Method PC + PLC
Power / Air Supply 380VAC, 3P, 50Hz, 132KW /0.5 Mpa, 200 L/min
DI Water Resistivity 0~18 MΩ
Machine Dimensions L7000*W1750*H1850 mm
Machine Weight 3600 KG

Technical Parameters





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