FC660 Inline Cleaning Machine PCBA Cleaner
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FC700 Inline Cleaning Machine PCBA Cleaner for high-reliability PCB
FC700 Inline Cleaning Machine PCBA Cleaner

FC660 Inline Cleaning Machine PCBA Cleaner

FC660 is a high-performance Inline Semiconductor Package Cleaning Machine designed specifically for advanced packaging applications including CSP, WLP, PLP, SiP, and FC devices. It is primarily used for the efficient removal of post-soldering flux residues.
It’s a PC-based control system and a mesh belt conveyor system, the FC660 utilizes top-and-bottom spray cleaning combined with multi-stage rinsing. As a new-generation, high-precision inline cleaning system, it ensures superior cleaning results and high stability during continuous production.

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Description

Features

SUS304 Stainless Steel: High rigidity, temperature/acid-alkali resistance, leak-proof.

High-Volume Inline System: For mass cleaning of packaged chips.

Spray Cleaning: Efficiently removes flux and organic/inorganic contaminants.

Workflow: chemical cleaning + multi-stage DI rinsing + extended hot air drying.

Auto Refill: Cleaning fluid and DI water auto-replenished.

Adjustable Parameters: Cleaning, rinsing, chemical isolation, air-knife pressure.

High-Pressure & Flow: Superior cleaning performance.

DI Water Monitoring: Equipped with rinsing water resistivity monitor.

Control System: PC-based, bilingual (CN/EN) GUI.

Integration & Options: Connectable to form auto line; optional SECS/GEM, chemical concentration detection & auto-compensation.

Specification document

Item Basic Specifications
Conveyor Belt Width 600 mm
Conveyor Speed 0.1~1.5 m/min
Conveyor Height 900 ± 50 mm
Conveyor Direction Left to Right
Cleaning Height 50 mm
Cleaning/Rinsing Tank Capacity 320 L / 140L
Filtration 1µm
DI Water Consumption 400~1000 L/H
Air Exhaust Volume 42 m³/H
Control Method PC + PLC
Power / Air Supply 380VAC, 3P, 50Hz, 132KW /0.5 Mpa, 200 L/min
DI Water Resistivity 0~18 MΩ
Machine Dimensions L7000*W1750*H1850 mm
Machine Weight 3600 KG

Technical Parameters





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