BC310GLTMFQ3X O-Ring Sealing Ring for Filter Barrel Fluorine Rubber Spare Parts for SMT Pneumatic Stencil Cleaning Machine Parts
BC310GLX101 Filter Element 10 Inch 1 Micron Spare Parts for SMT Pneumatic Stencil Cleaning Machine Parts
BC310JSQ Timer with 999S Spare Parts for SMT Pneumatic Stencil Cleaning Machine Parts
BC310MMFT Door Seal Strip 3M Fluorine Rubber Spare Parts for SMT Pneumatic Stencil Cleaning Machine Parts
BC310QDF Start Valve / Emergency Stop Valve ER/EP Spare Parts for SMT Pneumatic Stencil Cleaning Machine Parts
BC310QKF Pneumatic control valve 4A310-08/10 Spare Parts for SMT Pneumatic Stencil Cleaning Machine Parts
BC410 SMT Squeegee Auto Cleaning Machine Solder Paste Squeegee Blade Cleaner
The BC410 Squeegee Cleaning Machine features an integrated ultrasonic and spray cleaning system. It follows a standard three-step workflow: washing with water-based solder paste cleaning fluid, rinsing with DI water, and hot air drying. Each batch can clean 6 to 12 squeegees efficiently.
During operation, the squeegees are securely mounted on a special synchronous rotating fixture. This rotating design ensures thorough cleaning of all surfaces, including squeegee gaps, fixture contact areas, and both ends, achieving dead-angle-free cleaning. The result is complete removal of solder paste residues, restoring the squeegees' accuracy for immediate reuse in production.
BC420 Customized Cleaning Machine for Automatic Solder Paste Feeding Device
The BC420 is professionally designed to clean automatic solder paste feeding devices.
During operation, the automatic solder paste feeding device is fixed onto a rotating bracket inside the cleaning chamber, which keeps rotating throughout the process.
Combining the physical force of ultrasonic vibration and high-pressure spraying, together with the chemical dissolving power of water-based solder paste cleaning solution, the BC420 decomposes and removes residual solder paste from surfaces, corners and narrow gaps of the feeding device until thoroughly clean.
After cleaning, rinse the unit with DI water or purified tap water, followed by hot air drying to completely eliminate remaining moisture on the device.
BGA In-line Aqueous Cleaning Machine for Semiconductor Packaging | BGA Ball Mount Flux Cleaning Equipment FC610
The FC610 Inline Cleaning System is an automated solution engineered specifically for the removal of water‑soluble flux residues after the BGA solder ball mounting process. Designed for high‑reliability semiconductor packaging, the FC610 has double layer kevlay mesh to ensures consistent, stable and thorough cleaning.
It utilizes a sophisticated four-stage process consisting of heated DI water cleaning, DI water rinsing, hot air-knife air drying. This comprehensive workflow effectively removes flux residues from both the BGA package and the carrier plate, ensuring a thoroughly clean and dry surface.
DI-1000 Deionized Water Supply Machine Automatic Water Purifier RO DI Water for Cleaning Production
DI-1000 is used to turn tap water into DI water and supply to our PCBA batch type cleaning machine for DI water rinse after liquid cleaning. It consists of three main components: pre-treatment system, RO reverse osmosis system, and MB mixed bed system. The equipment features easy operation, stable performance, and fully automatic operation, ensuring high effluent resistivity.
DI-200 Deionized Water Supply Machine Automatic Water Purifier RO DI Water for Cleaning Production
DI200 is used to turn tap water into DI water and supply to our PCBA batch type cleaning machine for DI water rinse after liquid cleaning. It consists of three main components: pre-treatment system, RO reverse osmosis system, and MB mixed bed system. The equipment features easy operation, stable performance, and fully automatic operation, ensuring high effluent resistivity.
