Products

FC730 is FCBGA or SIP flux auto cleaning system, engineered for high‑precision flux removal in FCBGA (Flip Chip Ball Grid Array), FCCSP (Flip Chip Chip Scale Package) and SiP (System in Package) module manufacturing. As advanced packaging technologies continue to shrink component gaps and increase I/O density, the FC730 delivers the cleaning performance required to maintain high yield and reliability in modern semiconductor packaging assembly lines.

FC720 is a new-generation inline spray cleaning machine independently designed and manufactured by ACTSPRAY for automatic flux residue removal from PCBA assemblies, SiP modules and low-gap flip chip packages.

The system combines multi-stage chemical spray cleaning, chemical isolation, multi-stage DI water rinsing, air knife and hot air drying in one continuous inline process. Special spray nozzle combinations and adjustable upper/lower spray systems help cleaning liquids penetrate narrow gaps and remove flux residues from densely populated PCBA assemblies and low-standoff semiconductor packages.

With a 600 mm-wide stainless steel mesh conveyor, adjustable conveyor speed and fully monitored cleaning parameters, FC720 provides a stable and repeatable cleaning process for automated electronics and semiconductor packaging production lines.

Key Applications: PCBA Cleaning | SiP Cleaning | Flip Chip Cleaning | FCBGA Cleaning | FCCSP Cleaning | Low-Gap Package Cleaning | Flux Residue Removal