BC30 Nozzle Cleaning Machine adopts a multi-nozzle atomized water jet cleaning method to thoroughly remove residual solder paste from nozzles. The equipment features fully automatic cleaning, capable of processing 30 nozzles per cycle. Different nozzle models are matched with corresponding fixture trays, enabling compatibility with nozzles of all placement machine models. After cleaning, the nozzles are automatically dried with compressed air.
The High‑Temperature HEPA Filter (H14 grade) is engineered for extreme‑temperature air purification environments up to 500°C. Built with a 304 stainless‑steel outer frame, high‑temperature HEPA media, and heat‑resistant sealing strips, this filter delivers 99.995% efficiency at 0.3–0.5 μm, ensuring stable performance in demanding industrial processes such as reflow soldering, high‑temperature ovens, semiconductor packaging, and precision manufacturing.
AC460 bare PCB surface cleaning machine is designed to remove dust, particles, copper scraps and static electricity from bare PCBs before solder paste printing or adhesive coating. Featuring vacuum cleaning, tacky roller dedusting and ionized static elimination, AC460 helps improve print quality, reduce soldering defects and enhance PCB manufacturing reliability.