PCB/PCBA Cleaning Machine Offline SMT Cleaner for Small Batch PCB Assembly and Laboratory Flux Residual AC510

The Spertar AC510 Offline PCB/PCBA Cleaning Machine is designed for small‑to‑medium batch SMT and THT assembly cleaning. It integrates chemical washing, multi‑stage DI water rinsing, and hot‑air drying into a single chamber, effectively removing rosin flux, no‑clean flux, and water‑soluble flux residues to meet IPC high‑cleanliness standards.

PCB/PCBA Cleaning Machine Offline SMT Cleaner for Small Batch PCB Assembly and Laboratory Flux Residual AC530

The Spertar AC530 Offline PCB/PCBA Cleaning Machine is designed for small‑to‑medium batch SMT and THT assembly cleaning. It integrates chemical washing, multi‑stage DI water rinsing, and hot‑air drying into a single chamber, effectively removing rosin flux, no‑clean flux, and water‑soluble flux residues to meet IPC high‑cleanliness standards.

PCBA Batch Cleaning Machine for Circuit Board Assembly SIP Electronic Cleaning Equipment AC630

The Spertar AC630 is a high-performance Batch PCBA Cleaning Machine features vertical spray cleaning. The spray bars and air knives are fixed, while PCBA travels back and forth with fixtures (the most stable structure in pcb cleaning field), it can effectively remove flux from PCBs with fine-pitch and flip-chip components. AC620 fitted with dual tracks and two complete cleaning zones on both sides. Each zone is equipped with 4 high-pressure spray bars and 4 professional drying air knives. Two rows of SIP/PCBA can be processed at the same time, doubling the production capacity.

PCBA Batch Cleaning Machine for PCB Assembly SiP Modular Electronic Cleaning Equipment AC620

The Spertar AC620 is a high-performance Batch PCBA Cleaning Machine features vertical spray cleaning. The spray manifolds and air knives are fixed, while PCBA travels back and forth with fixtures (the most stable structure in pcb cleaning field), it can effectively remove flux from PCBs with fine-pitch and flip-chip components. AC620 fitted with dual tracks and two complete cleaning zones on both sides. Each zone is equipped with 4 high-pressure spray manifolds and 4 professional drying air knives. Two rows of SIP/PCBA can be processed at the same time, doubling the production capacity.

Pneumatic Dual Stencil Cleaner | Dual Chamber SMT Cleaning Machine BC310D

The BC310D is a pneumatic dual-chamber SMT stencil cleaning machine designed for high‑efficiency cleaning of solder paste and red glue stencils. With two independent cleaning systems, 1μm filtration, and fully pneumatic operation, it delivers maximum productivity, safety, and long-term reliability for SMT production lines.
✅ Dual independent cleaning systems clean 2 stencils simultaneously
100% pneumatic operation (no electricity required)
360° high-pressure spray cleaning system
Compatible with solvent and water-based cleaning liquids
Improve SMT printing quality & reduce defects

Pneumatic SMT Stencil Cleaner | Solder Paste Stencil Cleaning Machine BC310

The BC310 Pneumatic Stencil Cleaner is designed for fast, safe, and efficient cleaning of SMT stencils, removing solder paste and flux residue to ensure consistent printing performance and higher yield.
100% pneumatic operation (no electricity required)
360° high-pressure spray cleaning system
Compatible with solvent and water-based cleaning liquids
Improve SMT printing quality & reduce defects

Precision Filter Cartridge E30412XA, Precision Filter A3051XA, WLAKER Filter Element, KED Cleaning Machine Parts

Product Specifications: E30412X1 Product Type: pleated filter cartridge Filter element material: fiber filtration accuracy: 0.01 work pressure: other

SiP Inline Cleaning Machine for Semiconductor Packaging | Automatic PCB Cleaner FC820

FC820 is an automatic aqueous cleaning machine dedicated to remove flux from large-size and low-standoff gap SiP packaging modules and high-capacity PCBAs. As semiconductor packages continue evolving toward lower standoff heights, and higher I/O density, traditional cleaning methods struggle to remove flux residues beneath complex package structures. Typical cleaning challenges include: - Flux trapped under ultra-low standoff gap; - Incomplete cleaning under FCBGA (Flip Chip Ball Grid Array), FCCSP (Flip Chip Chip Scale Package) and 2.5D/3D packages; - Ionic contamination affecting reliability; - Cleaning consistency in high-volume inline production. The FC820 inline cleaning euipment is specifically engineered to solve these advanced packaging cleaning challenges.

Substrate Inline Cleaning Machine for Semiconductor Packaging | Organic Substrates Flux Cleaning Equipment FC760S

The FC760S  is a substrate inline cleaning machine designed for cleaning advanced packaging substrates, it adopting PC+PLC control system and stainless steel mesh conveyor, and dual-side spray washing/rinsing to remove flux residues efficiently. 

UC-250BV SMT PCB Surface Cleaning Machine

UC-250BV removes dust, fibers, and metal particles from PCB pads inline before printing. It guarantees a contaminant-free surface to eliminate soldering defects and maximize yield.

UC-250M-CV SMT PCB Surface Cleaning Machine

UC-250M-C integrates two distinct cleaning mechanisms: "Rotary Brush + Vacuum" and "Sticky Roller + Tack Roll." The system offers flexible operation modes, allowing both functions to run simultaneously or independently based on specific process requirements. Brush Cleaning System: Effectively removes particulates and larger foreign debris from the PCB surface. Roller Cleaning System: Targets micro-dust and electrostatically adsorbed particles for deep cleaning.