Aqueous cleaning uses heated pure water combined with physical high-pressure spray to remove water-soluble flux thoroughly. It features zero chemical residue, high consistency, and environmental compliance.
Inline continuous cleaning mode also perfectly matches modern high-speed SMT and semiconductor packaging lines, avoiding the low efficiency of batch cleaning.
Professional Equipment for Mass BGA Aqueous Cleaning
TheFC610 BGA inline aqueous cleaning machine is developed specifically for post-ball-mount BGA cleaning scenarios. It features precise temperature-controlled DI water cleaning, multi-stage circulating rinsing, and high-strength air knife drying, ensuring no flux residue and no water spots on BGA surfaces.
Its double-layer Kevlar mesh belt design ensures stable transmission during long-term inline operation, making it suitable for 24-hour continuous production in semiconductor packaging factories.
