BC210 Solder Pallet Cleaning Machine SMT Fixture Cleaner for PCB Assembly Line
BC210 Pallet Cleaner is specially designed for the automatic cleaning of flux residues on the surface of wave soldering pallets.
The equipment adopts a standardized three-stage process: water-based solution cleaning → tap water rinsing → hot air drying. Fully controlled by a PLC program, it supports one-click operation and batch cleaning mode. Boasting excellent compatibility, it is suitable for cleaning wave soldering pallets made of various materials including synthetic stone, glass fiber, stainless steel and alloy.
BGA In-line Aqueous Cleaning Systems for Semiconductor Packaging BGA Ball Mount Flux Cleaning Machine FC610
The FC610 Inline Cleaning System is an automated solution engineered specifically for the removal of water‑soluble flux residues after the BGA solder ball mounting process. Designed for high‑reliability semiconductor packaging, the FC610 has double layer kevlay mesh to ensures consistent, stable and thorough cleaning.
It utilizes a sophisticated four-stage process consisting of heated DI water cleaning, DI water rinsing, hot air-knife air drying. This comprehensive workflow effectively removes flux residues from both the BGA package and the carrier plate, ensuring a thoroughly clean and dry surface.
DI-1000 Deionized Water Supply Machine Automatic Water Purifier RO DI Water for Cleaning Production
DI-1000 is used to turn tap water into DI water and supply to our PCBA batch type cleaning machine for DI water rinse after liquid cleaning. It consists of three main components: pre-treatment system, RO reverse osmosis system, and MB mixed bed system. The equipment features easy operation, stable performance, and fully automatic operation, ensuring high effluent resistivity.
Electric SMT Stencil Cleaner | Automatic Solder Paste Stencil Cleaning Machine BC320
FC700 Inline Cleaning Machine PCBA Cleaner
FC700 is a high-performance Inline Semiconductor Package Cleaning Machine designed specifically for advanced packaging applications including CSP, WLP, PLP, SiP, and FC devices. It is primarily used for the efficient removal of post-soldering flux residues.
It's a PC-based control system and a mesh belt conveyor system, the FC700 utilizes top-and-bottom spray cleaning combined with multi-stage rinsing. As a new-generation, high-precision inline cleaning system, it ensures superior cleaning results and high stability during continuous production.
Inline Cleaning Machine for SiP, FCBGA & Advanced Semiconductor Packaging | Automatic PCB Cleaner FC820
As semiconductor packages continue evolving toward lower standoff heights, and higher I/O density, traditional cleaning methods struggle to remove flux residues beneath complex package structures.
Typical cleaning challenges include:
- Flux trapped under ultra-low gap components;
- Incomplete cleaning under FCBGA, FCCSP, 2.5D/3D packages;
- Ionic contamination affecting reliability;
- Cleaning consistency in high-volume inline production.
The FC820 inline cleaning system is specifically engineered to solve these advanced packaging cleaning challenges.
Inline Cleaning System for FCBGA, FCCSP & 2.5D/3D Packaging | Automatic PCB Cleaner FC800
The FC800 Inline Cleaning System is a high-performance semiconductor cleaning solution designed for advanced packaging processes, including FCBGA, FCCSP, and 2.5D/3D IC technologies.
Engineered to address the challenges of ultra-low standoff components and high-density packaging, the FC800 delivers precise and reliable removal of flux residues from complex assemblies. Its advanced spray system and optimized nozzle configuration ensure effective cleaning under fine-pitch devices and narrow gaps.
With intelligent PC+PLC control and a Windows-based operation interface, the system offers stable, automated, and user-friendly performance in high-volume production environments.
The integrated chemical management system, including real-time monitoring, auto compensation, and vapor recovery, significantly reduces operational costs while maintaining consistent cleaning quality.
Inline Cleaning System for FCBGA, FCCSP & SIP Flux Removal | Automatic PCB Cleaner FC760
The FC760 Inline Cleaning System is engineered for high‑precision flux removal in FCBGA, FCCSP, and SIP module manufacturing. As advanced packaging technologies continue to shrink component gaps and increase I/O density, the FC760 delivers the cleaning performance required to maintain high yield and reliability in modern semiconductor packaging assembly lines.
PCB/PCBA Cleaning Machine Automatic Inline SMT Cleaner for Large Batch PCB Assembly Lines Flux Residual BC680
BC680 is ideal for large batches PCBA cleaning. It adopts inline cleaning system with a sectional upper and lower spray cleaning method, through the process of chemical fluid cleaning + DI water rinsing + hot air drying, can completely removes rosin, flux residue and solder paste residues on SMT or THT PCBA after welding. It's used in industries such as automotive electronics, aerospace, communications, medical, MiniLED, and smart instrumentation.
PCB/PCBA Cleaning Machine Offline SMT Cleaner for Small Batch PCB Assembly and Laboratory Flux Residual AC530
The Spertar AC530 Offline PCB/PCBA Cleaning Machine is designed for small‑to‑medium batch SMT and THT assembly cleaning. It integrates chemical washing, multi‑stage DI water rinsing, and hot‑air drying into a single chamber, effectively removing rosin flux, no‑clean flux, and water‑soluble flux residues to meet IPC high‑cleanliness standards.
Pneumatic Dual Stencil Cleaner | Dual Chamber SMT Cleaning Machine BC310D
The BC310D is a pneumatic dual-chamber SMT stencil cleaning machine designed for high‑efficiency cleaning of solder paste and red glue stencils. With two independent cleaning systems, 1μm filtration, and fully pneumatic operation, it delivers maximum productivity, safety, and long-term reliability for SMT production lines.
✅ Dual independent cleaning systems clean 2 stencils simultaneously
✅ 100% pneumatic operation (no electricity required)
✅ 360° high-pressure spray cleaning system
✅ Compatible with solvent and water-based cleaning liquids
✅ Improve SMT printing quality & reduce defects
