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FC610 BGA Inline Aqueous Cleaning Machine for Solder Ball Mount Flux Removal
FC610 BGA Inline Aqueous Cleaning Machine for Solder Ball Mount Flux Removal

BGA In-line Aqueous Cleaning Machine for Semiconductor Packaging | BGA Ball Mount Flux Cleaning Equipment FC610

The FC610 Inline Cleaning System is an automated solution engineered specifically for the removal of water‑soluble flux residues after the BGA solder ball mounting process. Designed for high‑reliability semiconductor packaging, the FC610 has double layer kevlay mesh to ensures consistent, stable and thorough cleaning. It utilizes a sophisticated four-stage process consisting of heated DI water cleaning, DI water rinsing, hot air-knife air drying. This comprehensive workflow effectively removes flux residues from both the BGA package and the carrier plate, ensuring a thoroughly clean and dry surface.
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FC610 In-line cleaning machine mixed spray technology PCB cleaner

FC620 Inline Cleaning Machine PCBA Cleaner

FC620 is a high-performance Inline Semiconductor Package Cleaning Machine designed for a wide range of semiconductor packages, including LEADFRAME, IPM, BGA, CSP, and SIP. It is primarily used for the efficient removal of post-soldering flux residues. It's a PC-based control system and a mesh belt conveyor system, the FC620 utilizes top-and-bottom spray cleaning combined with multi-stage rinsing. As a new-generation, high-precision inline cleaning system, it ensures superior cleaning results and high stability during continuous production.
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fc730 inline cleaning machine advanced packaging cleaning machine for fcBGA SiP and chiplet semiconductor manufacturing
pcb inline cleaning system spertar clean

FC730 Inline Cleaning Machine for FCBGA Semiconductor Packaging Flux Removal | Automatic PCB Cleaner

FC730 is FCBGA or SIP flux auto cleaning system, engineered for high‑precision flux removal in FCBGA (Flip Chip Ball Grid Array), FCCSP (Flip Chip Chip Scale Package) and SiP (System in Package) module manufacturing. As advanced packaging technologies continue to shrink component gaps and increase I/O density, the FC730 delivers the cleaning performance required to maintain high yield and reliability in modern semiconductor packaging assembly lines.

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FC760 automatic FCBGA FCCSP SIP flux inline cleaning system for semiconductor advanced packaging
spertar-advanced semiconductor cleaning solution provider

FCBGA Inline Cleaning Machine for Semiconductor Packaging Flux Removal | Automatic PCB Cleaner FC760

The FC760 Inline Cleaning System is engineered for high‑precision flux removal in FCBGA (Flip Chip Ball Grid Array), FCCSP (Flip Chip Chip Scale Package) and SiP (System in Package) module manufacturing. As advanced packaging technologies continue to shrink component gaps and increase I/O density, the FC760 delivers the cleaning performance required to maintain high yield and reliability in modern semiconductor packaging assembly lines.

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High-performance inline cleaning system for FCBGA, FCCSP, and 2.5D/3D IC packaging. Removes flux residues in low-gap structures with precision and stability.
spertar-advanced semiconductor cleaning solution provider

Inline Cleaning System for FCBGA, FCCSP & 2.5D/3D Packaging | Automatic PCB Cleaner FC800

The FC800 is a high-performance semiconductor inline cleaning equipment designed for advanced packaging deflux processes, including FCBGA (Flip Chip Ball Grid Array), FCCSP (Flip Chip Chip Scale Package), and 2.5D/3D IC technologies.

Engineered to address the challenges of ultra-low standoff components and high-density packaging, the FC800 delivers precise and reliable removal of flux residues from complex assemblies. Its advanced spray system and optimized nozzle configuration ensure effective cleaning under fine-pitch devices and narrow gaps.

With intelligent PC+PLC control and a Windows-based operation interface, the system offers stable, automated, and user-friendly performance in high-volume production environments.

The integrated chemical management system, including real-time monitoring, auto compensation, and vapor recovery, significantly reduces operational costs while maintaining consistent cleaning quality.

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Spertar fc820 inline cleaning machine for large SIP modules
Advanced packaging cleaning machine for fcBGA SiP and chiplet semiconductor manufacturing

SiP Inline Cleaning Machine for Semiconductor Packaging | Automatic PCB Cleaner FC820

FC820 is an automatic aqueous cleaning machine dedicated to remove flux from large-size and low-standoff gap SiP packaging modules and high-capacity PCBAs. As semiconductor packages continue evolving toward lower standoff heights, and higher I/O density, traditional cleaning methods struggle to remove flux residues beneath complex package structures. Typical cleaning challenges include: - Flux trapped under ultra-low standoff gap; - Incomplete cleaning under FCBGA (Flip Chip Ball Grid Array), FCCSP (Flip Chip Chip Scale Package) and 2.5D/3D packages; - Ionic contamination affecting reliability; - Cleaning consistency in high-volume inline production. The FC820 inline cleaning euipment is specifically engineered to solve these advanced packaging cleaning challenges.
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FC760 automatic FCBGA FCCSP SIP flux inline cleaning system for semiconductor advanced packaging
spertar-advanced semiconductor cleaning solution provider

Substrate Inline Cleaning Machine for Semiconductor Packaging | Organic Substrates Flux Cleaning Equipment FC760S

The FC760S  is a substrate inline cleaning machine designed for cleaning advanced packaging substrates, it adopting PC+PLC control system and stainless steel mesh conveyor, and dual-side spray washing/rinsing to remove flux residues efficiently. 

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