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Pneumatic SMT Stencil Cleaner | Solder Paste Stencil Cleaning Machine BC310
The BC310 Pneumatic Stencil Cleaner is designed for fast, safe, and efficient cleaning of SMT stencils, removing solder paste and flux residue to ensure consistent printing performance and higher yield.✅ 100% pneumatic operation (no electricity required)✅ 360° high-pressure spray cleaning system✅ Compatible with solvent and water-based cleaning liquids✅ Improve SMT printing quality & reduce defects
Pneumatic Dual Stencil Cleaner | Dual Chamber SMT Cleaning Machine BC310D
The BC310D is a pneumatic dual-chamber SMT stencil cleaning machine designed for high‑efficiency cleaning of solder paste and red glue stencils. With two independent cleaning systems, 1μm filtration, and fully pneumatic operation, it delivers maximum productivity, safety, and long-term reliability for SMT production lines.✅ Dual independent cleaning systems clean 2 stencils simultaneously✅ 100% pneumatic operation (no electricity required)✅ 360° high-pressure spray cleaning system✅ Compatible with solvent and water-based cleaning liquids✅ Improve SMT printing quality & reduce defects
Electric SMT Stencil Cleaner | Automatic Solder Paste Stencil Cleaning Machine BC320
BC210 Solder Pallet Cleaning Machine SMT Fixture Cleaner for PCB Assembly Line
BC210 Pallet Cleaner is specially designed for the automatic cleaning of flux residues on the surface of wave soldering pallets. The equipment adopts a standardized three-stage process: water-based solution cleaning → tap water rinsing → hot air drying. Fully controlled by a PLC program, it supports one-click operation and batch cleaning mode. Boasting excellent compatibility, it is suitable for cleaning wave soldering pallets made of various materials including synthetic stone, glass fiber, stainless steel and alloy.
BC220 Reflow Oven Cooller Condenser Cleaning Machine
BC220 Reflow Oven Condenser Cleaner is designed for the automatic removal of flux residues from condensers, filters, and ventilation racks in lead-free reflow soldering machines. Controlled by a PLC system, it automatically executes a complete cycle of cleaning, rinsing, and hot air drying. This machine ensures thorough cleaning while perfectly protecting the heat sink fins from damage, making it an essential tool for regular maintenance to restore thermal efficiency.
BC410 SMT Squeegee Auto Cleaning Machine Solder Paste Squeegee Blade Cleaner
The BC410 Squeegee Cleaning Machine features an integrated ultrasonic and spray cleaning system. It follows a standard three-step workflow: washing with water-based solder paste cleaning fluid, rinsing with DI water, and hot air drying. Each batch can clean 6 to 12 squeegees efficiently. During operation, the squeegees are securely mounted on a special synchronous rotating fixture. This rotating design ensures thorough cleaning of all surfaces, including squeegee gaps, fixture contact areas, and both ends, achieving dead-angle-free cleaning. The result is complete removal of solder paste residues, restoring the squeegees' accuracy for immediate reuse in production.
BC420 Customized Cleaning Machine for Automatic Solder Paste Feeding Device
The BC420 is professionally designed to clean automatic solder paste feeding devices. During operation, the automatic solder paste feeding device is fixed onto a rotating bracket inside the cleaning chamber, which keeps rotating throughout the process. Combining the physical force of ultrasonic vibration and high-pressure spraying, together with the chemical dissolving power of water-based solder paste cleaning solution, the BC420 decomposes and removes residual solder paste from surfaces, corners and narrow gaps of the feeding device until thoroughly clean. After cleaning, rinse the unit with DI water or purified tap water, followed by hot air drying to completely eliminate remaining moisture on the device.
BC30 SMT Nozzle Cleaning Machine for Pick and Place Nozzle
BC30 Nozzle Cleaning Machine adopts a multi-nozzle atomized water jet cleaning method to thoroughly remove residual solder paste from nozzles. The equipment features fully automatic cleaning, capable of processing 30 nozzles per cycle. Different nozzle models are matched with corresponding fixture trays, enabling compatibility with nozzles of all placement machine models. After cleaning, the nozzles are automatically dried with compressed air. - PCBA Cleaning Machine
PCB/PCBA Cleaning Machine Offline SMT Cleaner for Small Batch PCB Assembly and Laboratory Flux Residual AC530
The Spertar AC530 Offline PCB/PCBA Cleaning Machine is designed for small‑to‑medium batch SMT and THT assembly cleaning. It integrates chemical washing, multi‑stage DI water rinsing, and hot‑air drying into a single chamber, effectively removing rosin flux, no‑clean flux, and water‑soluble flux residues to meet IPC high‑cleanliness standards.
PCB/PCBA Cleaning Machine Offline SMT Cleaner for Small Batch PCB Assembly and Laboratory Flux Residual AC510
The Spertar AC510 Offline PCB/PCBA Cleaning Machine is designed for small‑to‑medium batch SMT and THT assembly cleaning. It integrates chemical washing, multi‑stage DI water rinsing, and hot‑air drying into a single chamber, effectively removing rosin flux, no‑clean flux, and water‑soluble flux residues to meet IPC high‑cleanliness standards.
Automatic PCB/PCBA Cleaning Machine BC560 Inline SMT Cleaner for Large Batch PCB Assembly Lines Flux Residual
Automatic PCB/PCBA Cleaning Machine BC620 Online SMT Cleaner for Large Batch PCB Assembly Lines Flux Residual
Automatic PCB/PCBA Cleaning Machine Online SMT Cleaner for Large Batch PCB Assembly Lines Flux Residual BC610
The SPERTAR PCBA Cleaning Machine BC610 is ideal for large batches PCBA cleaning. It adopts inline cleaning system with a sectional upper and lower spray cleaning method, through the process of chemical fluid cleaning + DI water rinsing + hot air drying, can completely removes rosin flux, no-clean flux and water-soluble flux residues on SMT or THT PCBA after welding. It's used in industries such as automotive electronics, aerospace, communications, medical, MiniLED, and smart instrumentation.
PCB/PCBA Cleaning Machine Automatic Inline SMT Cleaner for Large Batch PCB Assembly Lines Flux Residual BC630
BC630 is ideal for large batches PCBA cleaning. It adopts inline cleaning system with a sectional upper and lower spray cleaning method, through the process of chemical fluid cleaning + DI water rinsing + hot air drying, can completely removes rosin, flux residue and solder paste residues on SMT or THT PCBA after welding. It's used in industries such as automotive electronics, aerospace, communications, medical, MiniLED, and smart instrumentation.
PCB/PCBA Cleaning Machine Automatic Inline SMT Cleaner for Large Batch PCB Assembly Lines Flux Residual BC660
The In-line PCBA Cleaning Machine BC660 is ideal for large batches PCBA cleaning. It adopts inline cleaning system with a sectional upper and lower spray cleaning method, through the process of chemical fluid cleaning + DI water rinsing + hot air drying, can completely removes rosin, flux residue and solder paste residues on SMT or THT PCBA after welding. It's used in industries such as automotive electronics, aerospace, communications, medical, MiniLED, and smart instrumentation.
PCB/PCBA Cleaning Machine Automatic Inline SMT Cleaner for Large Batch PCB Assembly Lines Flux Residual BC680
BC680 is ideal for large batches PCBA cleaning. It adopts inline cleaning system with a sectional upper and lower spray cleaning method, through the process of chemical fluid cleaning + DI water rinsing + hot air drying, can completely removes rosin, flux residue and solder paste residues on SMT or THT PCBA after welding. It's used in industries such as automotive electronics, aerospace, communications, medical, MiniLED, and smart instrumentation. - Semicon Packaging
BGA In-line Aqueous Cleaning Machine for Semiconductor Packaging | BGA Ball Mount Flux Cleaning Equipment FC610
The FC610 Inline Cleaning System is an automated solution engineered specifically for the removal of water‑soluble flux residues after the BGA solder ball mounting process. Designed for high‑reliability semiconductor packaging, the FC610 has double layer kevlay mesh to ensures consistent, stable and thorough cleaning. It utilizes a sophisticated four-stage process consisting of heated DI water cleaning, DI water rinsing, hot air-knife air drying. This comprehensive workflow effectively removes flux residues from both the BGA package and the carrier plate, ensuring a thoroughly clean and dry surface.
FC620 Inline Cleaning Machine PCBA Cleaner
FC620 is a high-performance Inline Semiconductor Package Cleaning Machine designed for a wide range of semiconductor packages, including LEADFRAME, IPM, BGA, CSP, and SIP. It is primarily used for the efficient removal of post-soldering flux residues. It's a PC-based control system and a mesh belt conveyor system, the FC620 utilizes top-and-bottom spray cleaning combined with multi-stage rinsing. As a new-generation, high-precision inline cleaning system, it ensures superior cleaning results and high stability during continuous production.
FC660 Inline Cleaning Machine PCBA Cleaner
FC660 is a high-performance Inline Semiconductor Package Cleaning Machine designed specifically for advanced packaging applications including CSP, WLP, PLP, SiP, and FC devices. It is primarily used for the efficient removal of post-soldering flux residues. It's a PC-based control system and a mesh belt conveyor system, the FC660 utilizes top-and-bottom spray cleaning combined with multi-stage rinsing. As a new-generation, high-precision inline cleaning system, it ensures superior cleaning results and high stability during continuous production.
FC700 Inline Cleaning Machine PCBA Cleaner
FC700 is a high-performance Inline Semiconductor Package Cleaning Machine designed specifically for advanced packaging applications including CSP, WLP, PLP, SiP, and FC devices. It is primarily used for the efficient removal of post-soldering flux residues. It's a PC-based control system and a mesh belt conveyor system, the FC700 utilizes top-and-bottom spray cleaning combined with multi-stage rinsing. As a new-generation, high-precision inline cleaning system, it ensures superior cleaning results and high stability during continuous production.
Inline Cleaning System for FCBGA, FCCSP & 2.5D/3D Packaging | Automatic PCB Cleaner FC800
The FC800 is a high-performance semiconductor inline cleaning equipment designed for advanced packaging deflux processes, including FCBGA (Flip Chip Ball Grid Array), FCCSP (Flip Chip Chip Scale Package), and 2.5D/3D IC technologies.
Engineered to address the challenges of ultra-low standoff components and high-density packaging, the FC800 delivers precise and reliable removal of flux residues from complex assemblies. Its advanced spray system and optimized nozzle configuration ensure effective cleaning under fine-pitch devices and narrow gaps.
With intelligent PC+PLC control and a Windows-based operation interface, the system offers stable, automated, and user-friendly performance in high-volume production environments.
The integrated chemical management system, including real-time monitoring, auto compensation, and vapor recovery, significantly reduces operational costs while maintaining consistent cleaning quality.
FCBGA Inline Cleaning Machine for Semiconductor Packaging Flux Removal | Automatic PCB Cleaner FC760
The FC760 Inline Cleaning System is engineered for high‑precision flux removal in FCBGA (Flip Chip Ball Grid Array), FCCSP (Flip Chip Chip Scale Package) and SiP (System in Package) module manufacturing. As advanced packaging technologies continue to shrink component gaps and increase I/O density, the FC760 delivers the cleaning performance required to maintain high yield and reliability in modern semiconductor packaging assembly lines.
SiP Inline Cleaning Machine for Semiconductor Packaging | Automatic PCB Cleaner FC820
FC820 is an automatic aqueous cleaning machine dedicated to remove flux from large-size and low-standoff gap SiP packaging modules and high-capacity PCBAs. As semiconductor packages continue evolving toward lower standoff heights, and higher I/O density, traditional cleaning methods struggle to remove flux residues beneath complex package structures. Typical cleaning challenges include: - Flux trapped under ultra-low standoff gap; - Incomplete cleaning under FCBGA (Flip Chip Ball Grid Array), FCCSP (Flip Chip Chip Scale Package) and 2.5D/3D packages; - Ionic contamination affecting reliability; - Cleaning consistency in high-volume inline production. The FC820 inline cleaning euipment is specifically engineered to solve these advanced packaging cleaning challenges.Substrate Inline Cleaning Machine for Semiconductor Packaging | Organic Substrates Flux Cleaning Equipment FC760S
- Other Machine
UC-250BV SMT PCB Surface Cleaning Machine
UC-250M-CV SMT PCB Surface Cleaning Machine
UC-250M-C integrates two distinct cleaning mechanisms: "Rotary Brush + Vacuum" and "Sticky Roller + Tack Roll." The system offers flexible operation modes, allowing both functions to run simultaneously or independently based on specific process requirements. Brush Cleaning System: Effectively removes particulates and larger foreign debris from the PCB surface. Roller Cleaning System: Targets micro-dust and electrostatically adsorbed particles for deep cleaning.
DI-1000 Deionized Water Supply Machine Automatic Water Purifier RO DI Water for Cleaning Production
DI-1000 is used to turn tap water into DI water and supply to our PCBA batch type cleaning machine for DI water rinse after liquid cleaning. It consists of three main components: pre-treatment system, RO reverse osmosis system, and MB mixed bed system. The equipment features easy operation, stable performance, and fully automatic operation, ensuring high effluent resistivity.
AC100 Ion Contamination Tester for PCBs and Electronic Components Cleanliness Tester
AC100 is an ionic contamination tester for PCBA, PCB and semiconductor parts. According to the method of ionic contamination degree test defined in IPC-TM-650, the test process includes 3 processes: solvent regeneration, ion contamination solvent extraction and ion contamination degree measurement. This tester adopts a high-purity, high-capacity ion exchange device. Before each test, the solvent is regenerated through the ion exchange device according to the setting value to ensure that the ion content in the solvent meets the test requirements before each test. - Accessories
BC310MMFT Door Seal Strip 3M Fluorine Rubber Spare Parts for SMT Pneumatic Stencil Cleaning Machine
BC310GLX101 Filter Element 10 Inch 1 Micron Spare Parts for SMT Pneumatic Stencil Cleaning Machine
BC310GLTMFQ3X O-Ring for Filter Barrel Fluorine Rubber Spare Parts for SMT Pneumatic Stencil Cleaning Machine
BC310JSQ Timer with 999S Spare Parts for SMT Pneumatic Stencil Cleaning Machine
BC310QKF Pneumatic control valve 4A310-08/10 Spare Parts for SMT Pneumatic Stencil Cleaning Machine
BC310QDF Start Valve / Emergency Stop Valve ER/EP Spare Parts for SMT Pneumatic Stencil Cleaning Machine
BC310GLD80M Filter Bag (Customized) Spare Parts for SMT Pneumatic Stencil Cleaning Machine
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