Inline Cleaning Machine for Lower Standoff Heights SIP Modules | Automatic Online PCB Cleaner FC820
Inline Cleaning System for FCBGA, FCCSP & 2.5D/3D Packaging | Automatic Online PCB Cleaner FC800
The FC800 Inline Cleaning System is a high-performance semiconductor cleaning solution designed for advanced packaging processes, including FCBGA, FCCSP, and 2.5D/3D IC technologies.
Engineered to address the challenges of ultra-low standoff components and high-density packaging, the FC800 delivers precise and reliable removal of flux residues from complex assemblies. Its advanced spray system and optimized nozzle configuration ensure effective cleaning under fine-pitch devices and narrow gaps.
With intelligent PC+PLC control and a Windows-based operation interface, the system offers stable, automated, and user-friendly performance in high-volume production environments.
The integrated chemical management system, including real-time monitoring, auto compensation, and vapor recovery, significantly reduces operational costs while maintaining consistent cleaning quality.
