Inline Cleaning Machine for SiP, FCBGA & Advanced Semiconductor Packaging | Automatic PCB Cleaner FC820
As semiconductor packages continue evolving toward lower standoff heights, and higher I/O density, traditional cleaning methods struggle to remove flux residues beneath complex package structures.
Typical cleaning challenges include:
- Flux trapped under ultra-low gap components;
- Incomplete cleaning under FCBGA, FCCSP, 2.5D/3D packages;
- Ionic contamination affecting reliability;
- Cleaning consistency in high-volume inline production.
The FC820 inline cleaning system is specifically engineered to solve these advanced packaging cleaning challenges.
