SiP Inline Cleaning Machine for Semiconductor Packaging | Automatic PCB Cleaner FC820
FC820 is an automatic aqueous cleaning machine dedicated to remove flux from large-size and low-standoff gap SiP packaging modules and high-capacity PCBAs.
As semiconductor packages continue evolving toward lower standoff heights, and higher I/O density, traditional cleaning methods struggle to remove flux residues beneath complex package structures.
Typical cleaning challenges include:
- Flux trapped under ultra-low standoff gap;
- Incomplete cleaning under FCBGA (Flip Chip Ball Grid Array), FCCSP (Flip Chip Chip Scale Package) and 2.5D/3D packages;
- Ionic contamination affecting reliability;
- Cleaning consistency in high-volume inline production.
The FC820 inline cleaning euipment is specifically engineered to solve these advanced packaging cleaning challenges.
