BC310GLTMFQ3X O-Ring for Filter Barrel Fluorine Rubber Spare Parts for SMT Pneumatic Stencil Cleaning Machine
BC310GLX101 Filter Element 10 Inch 1 Micron Spare Parts for SMT Pneumatic Stencil Cleaning Machine
BC310JSQ Timer with 999S Spare Parts for SMT Pneumatic Stencil Cleaning Machine
BC310MMFT Door Seal Strip 3M Fluorine Rubber Spare Parts for SMT Pneumatic Stencil Cleaning Machine
BC310QDF Start Valve / Emergency Stop Valve ER/EP Spare Parts for SMT Pneumatic Stencil Cleaning Machine
BC310QKF Pneumatic control valve 4A310-08/10 Spare Parts for SMT Pneumatic Stencil Cleaning Machine
BC320 Electric SMT Stencil Cleaning Machine for PCB Assembly Solder Paste Stencil Washing
BC320 Stencil Cleaner is suitable for cleaning solder paste stencils, red glue stencils, red glue copper stencils and red glue resin stencils in SMT processes, and can also realize automatic cleaning of misprinted PCBs and PCBAs.
The equipment adopts a three-stage processing procedure of spray cleaning + DI water rinsing + hot air drying, using water-based cleaning fluid throughout the process for excellent environmental friendliness and cleaning performance. During the cleaning process, the stencil is driven by a motor to move back and forth at a constant speed, while the spray rods and air knives on both sides remain stationary. Through the efficient coordination of dynamic cleaning and static spraying, it fully ensures the stability and reliability of equipment operation, as well as the high cleanliness of stencils after cleaning.
BC410 Squeegee Auto Cleaning Machine SMT Solder Paste Cleaner
The BC410 Squeegee Cleaning Machine features an integrated ultrasonic and spray cleaning system. It follows a standard three-step workflow: washing with water-based solder paste cleaning fluid, rinsing with DI water, and hot air drying. Each batch can clean 6 to 12 squeegees efficiently.
During operation, the squeegees are securely mounted on a special synchronous rotating fixture. This rotating design ensures thorough cleaning of all surfaces, including squeegee gaps, fixture contact areas, and both ends, achieving dead-angle-free cleaning. The result is complete removal of solder paste residues, restoring the squeegees' accuracy for immediate reuse in production.
BC420 Customized Cleaning Machine for Automatic Solder Paste Feeding Device
The BC420 is professionally designed to clean automatic solder paste feeding devices.
During operation, the automatic solder paste feeding device is fixed onto a rotating bracket inside the cleaning chamber, which keeps rotating throughout the process.
Combining the physical force of ultrasonic vibration and high-pressure spraying, together with the chemical dissolving power of water-based solder paste cleaning solution, the BC420 decomposes and removes residual solder paste from surfaces, corners and narrow gaps of the feeding device until thoroughly clean.
After cleaning, rinse the unit with DI water or purified tap water, followed by hot air drying to completely eliminate remaining moisture on the device.
DI-1000 Deionized Water Supply Machine Automatic Water Purifier RO DI Water for Cleaning Production
DI-1000 is used to turn tap water into DI water and supply to our PCBA batch type cleaning machine for DI water rinse after liquid cleaning. It consists of three main components: pre-treatment system, RO reverse osmosis system, and MB mixed bed system. The equipment features easy operation, stable performance, and fully automatic operation, ensuring high effluent resistivity.
DI-200 Deionized Water Supply Machine Automatic Water Purifier RO DI Water for Cleaning Production
DI200 is used to turn tap water into DI water and supply to our PCBA batch type cleaning machine for DI water rinse after liquid cleaning. It consists of three main components: pre-treatment system, RO reverse osmosis system, and MB mixed bed system. The equipment features easy operation, stable performance, and fully automatic operation, ensuring high effluent resistivity.
FC610 BGA Inline Cleaning Machine for high-reliability PCB Assemblies
FC610 is an automated cleaning system designed specifically for the removal of water-soluble flux residues following the BGA solder ball mounting process.
It utilizes a sophisticated four-stage process consisting of heated DI water cleaning, DI water rinsing, air-knife drying, and hot air drying. This comprehensive workflow effectively removes flux residues from both the BGA package and the carrier plate, ensuring a thoroughly clean and dry surface.
