Features
SUS304 Stainless Steel: High-rigidity structure with temperature, acid, and alkali resistance; leak-proof design.
High-Volume Inline System: Engineered for mass production of packaged chips.
Comprehensive Cleaning: Spray cleaning and rinsing effectively remove organic/inorganic contaminants (flux).
Extended Process Zones: Features long chemical cleaning, multi-stage DI rinsing, and extended hot air drying.
High-Pressure Efficiency: High-flow, high-pressure cleaning ensures superior results.
Smart Fluid Management: Automatic chemical and DI water refill; resistivity monitoring for rinsing water.
Adjustable Parameters: Configurable cleaning, rinsing, chemical isolation, and air-knife pressure.
User-Friendly Interface: PC control with a bilingual (Chinese/English) graphical interface.
Factory Integration: Connectable with other equipment to form an automated line.
Advanced Options: Optional SECS/GEM communication and automatic chemical concentration detection.
Equipment structure
fc610-inline-cleaning-machine-for-bga-pcb
Specification document
| Item | Basic Specifications |
| PCB Size | Max L300*W600mm, T 0.5~3.5mm |
| Conveyor Belt Width | 600 mm |
| Conveyor Speed | 0.1~1.5 m/min |
| Conveyor Direction | Left to Right |
| Conveyor Height | 900 ± 50 mm |
| Cleaning Temp. | Room Temp~70℃ |
| Rinsing Temp. | Room Temp~70℃ |
| Final Rinse Temp. | Room Temp~60℃ |
| Drying Temp. | Room Temp~100℃ |
| DI Water Supply | 6~12 L/min |
| DI Water Resistivity | 0~18 MΩ |
| Air Extraction | 36 m³/min (3 x 250mm Top Vents) |
| Total Power | 110 KW |
| Power Supply | AC 380V, 3P, 50/60Hz |
| Air Supply | 0.5~0.7 Mpa, 200 L/min |
| Machine Dimensions | L3500 x W1850 x H1950 (mm) |
| Machine Weight | 2200 KG |
