Advanced packaging technologies such as SiP, WLP, and fcBGA demand higher cleanliness standards than ever before. As line widths shrink and device density increases, even microscopic residues can cause electrical leakage or reliability degradation.
Batch cleaning systems struggle to keep up with the throughput and consistency required by modern factories. Inline cleaning, by contrast, offers continuous processing, stable parameters, and seamless integration with automated production lines.
FC610 adopts double-layer Kevlar net conveyor system with large flow rate upper & lower symmetrical spray water to remove water-soluble flux residuals on balls and substrates after BGA ball placement and soldering.
FC610 is designed specifically for these next‑generation requirements. With SMEMA compatibility, MES/SECS‑GEM integration options, and a stainless‑steel corrosion‑resistant structure, it fits naturally into high‑volume packaging lines.
Its four‑stage cleaning process ensures that even complex substrates achieve uniform cleanliness. For factories transitioning to Industry 4.0, FC610 provides the data connectivity and automation readiness needed for long‑term scalability.
FC610 adopts double-layer Kevlar net conveyor system with large flow rate upper & lower symmetrical spray water to remove water-soluble flux residuals on balls and substrates after BGA ball placement and soldering.
CTA: Explore FC610’s role in advanced packaging → FC610 BGA inline cleaning machine
