FC730 Inline Cleaning Machine for FCBGA Semiconductor Packaging Flux Removal | Automatic PCB Cleaner (复制)

FC720 Inline PCBA & Flip Chip Cleaning Machine – Automatic Inline Flux Cleaning for PCBA, SiP & Low-Gap Flip Chip Packages

FC720 is a new-generation inline spray cleaning machine independently designed and manufactured by ACTSPRAY for automatic flux residue removal from PCBA assemblies, SiP modules and low-gap flip chip packages.

The system combines multi-stage chemical spray cleaning, chemical isolation, multi-stage DI water rinsing, air knife and hot air drying in one continuous inline process. Special spray nozzle combinations and adjustable upper/lower spray systems help cleaning liquids penetrate narrow gaps and remove flux residues from densely populated PCBA assemblies and low-standoff semiconductor packages.

With a 600 mm-wide stainless steel mesh conveyor, adjustable conveyor speed and fully monitored cleaning parameters, FC720 provides a stable and repeatable cleaning process for automated electronics and semiconductor packaging production lines.

FC720 Inline PCBA & Flip Chip Cleaning Machine

Automatic Inline Flux Cleaning for PCBA, SiP & Low-Gap Flip Chip Packages

Deep Flux Cleaning for PCBA & Low-Gap Packages

As component density increases and package gaps become smaller, flux residues become increasingly difficult to remove.

Flux may remain:

Between densely populated components
Under low-standoff components
Inside FCBGA and FCCSP gaps
Around fine-pitch solder joints
On the bottom surface of semiconductor packages

These residues can affect electrical reliability, cleanliness and downstream processes.

FC720 addresses these challenges through the combination of:

Chemical Action + Mechanical Spray Action + Multi-Stage Rinsing + Controlled Drying

The heated cleaning solution helps soften and chemically break down flux residues, while high-pressure spray mechanically removes the softened contamination from the product surface and difficult-to-reach areas.

Multi-Stage Cleaning for Difficult Flux Residues

FC720 features three independent chemical cleaning sections, each approximately 630 mm long, providing a total cleaning length of 1,890 mm.

Each cleaning section is equipped with an independent pump to provide stable spray pressure and sufficient cleaning flow.

The combination of extended cleaning time, heated cleaning chemistry and mechanical spray action helps:

Soften → Decompose → Dislodge → Remove

flux residues from PCBA assemblies and low-gap flip chip packages.

Adjustable Spray Configuration

The spray bars can be configured in different orientations according to the product structure.

Upper and lower spray cleaning
Adjustable spray pressure
Adjustable spray angle
Multiple special nozzle configurations
Horizontal or longitudinal spray bar arrangement
Independent pump for each cleaning section

This configuration helps improve spray coverage around dense components and narrow package gaps.

Designed for Low-Gap Flip Chip Cleaning

Low-gap packages such as FCBGA and FCCSP can present significant cleaning challenges because flux residues may accumulate in narrow spaces beneath the package.

FC720 uses specially selected spray nozzles and adjustable spray-bar configurations to improve cleaning liquid penetration into these areas.

Suitable for:

Flip Chip packages
FCBGA
FCCSP
SiP modules
Low-standoff semiconductor packages
Fine-pitch PCBA assemblies
High-density electronic assemblies

The cleaning process can be optimized according to package structure, contamination type, flux chemistry and required cleanliness level.

Complete Inline Cleaning Process

Process Flow

Loading → Chemical Cleaning 1 → Chemical Cleaning 2 → Chemical Cleaning 3 → Chemical Isolation → DI Water Pre-Rinse → DI Water Rinse 1 → DI Water Rinse 2 → Final DI Water Rinse → Air Knife → Hot Air Drying 1 → Hot Air Drying 2 → Unloading

1. Chemical Cleaning 1

The first cleaning stage begins the removal of flux residues using heated chemical cleaning solution and spray action.

2. Chemical Cleaning 2

A second independent cleaning stage provides additional cleaning time and spray energy for stubborn flux residues.

3. Chemical Cleaning 3

The third cleaning stage completes the main flux removal process and improves cleaning consistency for difficult contamination.

4. Chemical Isolation

A high-pressure blower and upper/lower air knives remove residual cleaning liquid from the product and minimize chemical carryover into the rinsing sections.

5. DI Water Pre-Rinse

The first DI water stage removes remaining cleaning solution from the product surface.

6. DI Water Rinse 1 & 2

Multiple DI water rinsing stages progressively remove residual chemicals and reduce ionic contamination.

7. Final DI Water Rinse

The final rinse uses controlled DI water to provide the required surface cleanliness before drying.

8. Air Knife

High-pressure air removes surface water and reduces the moisture load entering the drying section.

9. Hot Air Drying 1 & 2

Two-stage hot air drying removes residual moisture from the PCBA or semiconductor package before it enters the next production process.

5-Stage DI Water Rinsing System

FC720 is equipped with an extended multi-stage DI water rinsing system to improve rinsing efficiency and reduce chemical carryover.

The rinsing system features:

DI water resistivity monitoring
Electronic flow monitoring
Adjustable water temperature
Multiple DI water rinse stages
Rear-to-front overflow water renewal
Final DI water rinse

The rear-to-front overflow design progressively improves water cleanliness toward the final rinsing stage, helping reduce ionic contamination while controlling DI water consumption.

Continuous Inline Cleaning with Stable Throughput

FC720 uses a 600 mm-wide stainless steel mesh conveyor for continuous product transfer.

The conveyor speed can be adjusted from:

0.05–1.5 m/min

For example, when cleaning 300 × 250 mm products, with the 300 mm side positioned in the conveying direction, a conveyor speed of 30 cm/min and approximately 10 mm spacing allow two products to be processed side by side.

The theoretical throughput is approximately:

116 pcs/hour

Actual production capacity depends on product dimensions, loading arrangement, spacing, cleaning requirements and process parameters.

This continuous conveyor design allows FC720 to operate as part of an automated production line.

Real-Time Process Monitoring & Control

FC720 uses an Industrial PC + PLC control system with a Windows-based operating interface.

Key process parameters can be digitally controlled, monitored and recorded.

Cleaning Parameters

Conveyor speed
Pre-cleaning pressure
Chemical cleaning pressure
Pre-rinse pressure
Rinse 1 pressure
Rinse 2 pressure
Final rinse pressure
Chemical isolation air pressure
Air knife pressure
Cleaning solution temperature
Pre-rinse water temperature
Rinse water temperature
Final DI water temperature

Pressure and temperature parameters are monitored in real time, with upper/lower limit alarms to help maintain process stability.

Industrial PC + PLC Control

The FC720 control system provides centralized management of machine operation and process parameters.

Standard Control Functions

Industrial PC + PLC control
Windows operating system
Chinese/English interface
Real-time parameter monitoring
Pressure monitoring and alarms
Temperature monitoring and alarms
Liquid level monitoring
Leak detection
Over-temperature protection
Energy-saving standby mode
Product in/out detection
Product tracking
MES connectivity

Optional cleaning solution concentration monitoring and automatic compensation can be added for applications requiring tighter chemical process control.

Built for Long-Term Industrial Cleaning

The machine body is constructed from SUS304 stainless steel using integrated argon arc welding.

The structure provides:

High structural rigidity
Corrosion resistance
Heat resistance
Chemical resistance
Long-term durability
Easy cleaning and maintenance

The liquid tanks use reinforced welded construction for reliable long-term operation with heated chemical cleaning solutions.

Reduce Cleaning Chemical Consumption

FC720 incorporates several features designed to reduce operating costs.

Dual-Stage Condensation Recovery

The cleaning system uses a two-stage extended condensation recovery system to recover a significant portion of evaporated cleaning solution.

Automatic Chemical Addition

A dedicated concentrated chemical tank and diaphragm pump allow automatic addition and discharge of cleaning solution.

Controlled DI Water Supply

An electronic flow meter monitors DI water consumption in real time, helping maintain cleaning quality while controlling water usage.

Energy-Saving Mode

The machine can automatically enter an energy-saving standby state when products are not detected.

Safety & Production Protection

FC720 incorporates multiple protection systems for reliable industrial operation.

Safety Features

Liquid leakage detection
Water leakage detection
Automatic alarm and shutdown
Double-layer bottom structure
Liquid collection tray
High/low liquid-level protection
PID temperature control
Dual temperature sensors
EGO over-temperature protection
Phase-loss protection
Phase-sequence protection
Electrical overload protection
Surge protection
Leakage protection switch
Multiple emergency-stop switches

These systems help protect operators, equipment and production products during continuous operation.

Smart Factory & MES Integration

FC720 can be integrated into automated production lines and smart factory systems.

The machine supports:

Product barcode scanning
Product traceability
MES integration
SECS/GEM communication
SMEMA signal interface
Upstream/downstream equipment communication
Product entry/exit detection
Process data monitoring

The system can record product and process information to support production traceability and process management.

Applications

PCBA Cleaning

Designed for automatic removal of flux residues from densely populated PCBA assemblies.

Typical applications:

SMT assemblies
Automotive electronics
Industrial electronics
Power electronics
High-reliability electronics
Fine-pitch PCBA

SiP Cleaning

FC720 can be configured for automatic cleaning of flux residues from SiP modules, including residues located around densely integrated components and package gaps.

Flip Chip Cleaning

The adjustable upper/lower spray system and special nozzle combinations help improve cleaning coverage for low-gap flip chip packages.

Applicable packages include:

FCBGA
FCCSP
Flip Chip
Low-standoff packages
Advanced semiconductor packages

FC720 Technical Specifications

Item	Specification
Application	PCBA / Flip Chip / SiP Flux Cleaning
Maximum Product Size	W600 × T100 mm
Conveyor Width	600 mm
Conveyor Speed	0.05–1.5 m/min
Conveyor Height	900 ± 25 mm
Conveyor Direction	Left to Right
Cleaning Temperature	Room Temperature–80°C
Pre-Rinse Water Temperature	Room Temperature–70°C
Rinse 1 & 2 Water Temperature	Room Temperature–70°C
Final Rinse Temperature	Room Temperature–60°C
Hot Air Drying Temperature	Room Temperature–100°C
Optional Drying Temperature	Up to 140°C
Cleaning Filtration	5 μm / 5 μm / 5 μm
Chemical Isolation / Air Knife Filtration	1 μm / 1 μm
DI Water Flow	6–15 L/min
DI Water Resistivity	0–18 MΩ·cm
Exhaust Volume	42 m³/min
Total Power	180 kW
Power Supply	AC380V, 3P, 50/60 Hz, 300 A
Air Supply	0.5–0.7 MPa, 200 L/min
Noise Level	Approx. 80 dB
Machine Dimensions	L7100 × W1850 × H1700 mm
Machine Weight	Approx. 4000 kg

Specifications may be customized according to product dimensions, flux type, required cleanliness level, throughput and production-line configuration.

FC720 Key Features at a Glance

3-Stage Extended Chemical Cleaning

Three independent cleaning sections with a total cleaning length of 1,890 mm provide extended cleaning time for difficult flux residues.

Multi-Nozzle Spray System

Special nozzle combinations improve spray coverage around dense components and narrow package gaps.

Adjustable Upper & Lower Spray

Spray pressure and spray angle can be adjusted according to different PCBA and semiconductor package structures.

Multi-Stage DI Water Rinsing

Extended DI water rinsing progressively removes residual cleaning chemicals and ionic contamination.

600 mm Stainless Steel Mesh Conveyor

Continuous product conveying supports automated production and allows two 300 mm-wide products to be processed side by side.

Real-Time Process Monitoring

Pressure, temperature, DI water flow, resistivity and other key parameters can be monitored in real time.

Automated Chemical Management

Automatic chemical addition and discharge simplify chemical management and improve process consistency.

MES & SECS/GEM Connectivity

Barcode tracking, MES integration, SMEMA and SECS/GEM communication support smart factory production.

From Flux Residue to Clean, Dry Products

FC720 integrates the complete cleaning process into one automated system:

Chemical Cleaning → Chemical Isolation → DI Water Rinsing → Air Knife → Hot Air Drying

Products enter from the loading end and continuously pass through each process section according to the programmed conveyor speed.

After cleaning and drying, the PCBA or semiconductor package exits the machine ready for the next manufacturing process.

FC720 can also be connected with automatic loading/unloading and conveyor systems to create a complete automated inline cleaning line.

Need to Clean PCBA, SiP or Flip Chip Packages?

Every product has a different flux chemistry, package structure and cleaning requirement.

ACTSPRAY can evaluate your actual products and recommend the appropriate:

Cleaning chemistry
Spray nozzle configuration
Cleaning pressure
Cleaning temperature
Rinsing process
Drying parameters
Conveyor speed
Machine configuration

Send Us Your Samples for a Cleaning Test

For difficult applications such as low-gap FCBGA, FCCSP, SiP and densely populated PCBA, a cleaning test is recommended before equipment selection.

Request a Cleaning Test

Get FC720 Quote

Frequently Asked Questions

What products can FC720 clean?

FC720 is designed for automatic flux cleaning of PCBA assemblies, SiP modules, flip chip packages, FCBGA, FCCSP and other low-gap electronic or semiconductor packages.

Can FC720 clean flux under low-gap flip chip packages?

Yes. FC720 uses special spray nozzle combinations and adjustable upper/lower spray configurations to improve cleaning liquid penetration into narrow gaps.

What type of flux can FC720 remove?

The machine can be configured for different flux residues, including rosin-based, no-clean and water-soluble flux. The actual cleaning chemistry and parameters should be determined through testing according to the customer’s flux type.

Is FC720 an inline cleaning machine?

Yes. FC720 is a continuous inline spray cleaning machine with a stainless steel mesh conveyor. It can be connected with upstream and downstream equipment to form an automated cleaning line.

What is the maximum product width?

The standard maximum product width is 600 mm, with a maximum product thickness of 100 mm.

What is the conveyor speed?

The conveyor speed is adjustable from 0.05 to 1.5 m/min, allowing the cleaning process to be matched to different products and cleanliness requirements.

Can FC720 connect to MES?

Yes. FC720 supports barcode scanning, product traceability, MES integration, SMEMA and SECS/GEM communication.

Can the cleaning process be customized?

Yes. Spray nozzle configuration, spray pressure, spray angle, temperature, conveyor speed, cleaning chemistry and other process parameters can be adjusted according to the customer’s products and cleaning requirements.