Why cleaning is critical?
Advanced chip packaging technologies such as SiP, FCBGA, PoP and 2.5D/3D Packaging are driving high-performance computing development, yet they also bring severe flux residue cleaning challenges. Larger dies, more solder bumps and ultra-low standoff heights greatly complicate post-reflow flux removal. With standoff heights decreasing to less than 50μ, outgassing during reflow diminishes, further complicating fux residue removal. Components such as QFNs and LGAs with large thermal pads add to these challenges, risking reliability issues including electrochemical migration and electrical leakage.
Key Features of FC820 Inline Cleaning System
1. Industrial PC+PLC Control with English Windows Interface
Features reliable industrial PC+PLC integrated control with long-term stable operation. The Windows-based English operation interface supports simple parameter configuration and intuitive operation.
2. Super Long Chemical Wash Section with Adjustable Spray
Equipped with an extended super-long chemical wash section, supporting flexible adjustment of chemical spray pressure and angle. It provides uniform, full-coverage chemical cleaning for big-size SIP modules, thoroughly decomposing and removing stubborn flux residues hidden in low-gap structures.
3. Custom Combined Spray Nozzle Kits for Low Standoff Heights SIP Modules
Exclusive combined spray nozzle kits are customized for the structural characteristics of low standoff heights SIP modulars.
4. Chemical Isolation & Adjustable Air Blow System
The independent chemical isolation section completely isolates cleaning and rinsing processes to prevent cross-contamination. The air blow section supports adjustable air pressure and blowing angle, rapidly removing residual chemical liquid and surface particles to ensure dry and clean SIP module surfaces.
5. Automatic Chemical Add & Drain Device
Realizes unmanned automatic chemical feeding and drainage, reducing manual operation errors and labor costs. It stabilizes cleaning liquid supply conditions, improves production continuity and overall operational efficiency for SIP packaging lines.
6. Chemical Vapor Cooling & Recovery System for Cost Saving
Integrated professional chemical vapor cooling and recovery system effectively recycles volatile chemical solvents, drastically reducing chemical waste and consumption. It significantly lowers long-term production operating costs for semiconductor packaging enterprises with eco-friendly performance.
7. Independent Chemical Temperature Cooling System
The dedicated chemical temperature cooling system maintains the cleaning solution at a constant optimal temperature during batch production. It eliminates cleaning quality fluctuations caused by temperature changes, ensuring consistent and reliable cleaning results for mass SIP module production.
8. DI Water Resistivity & Flow Rate Inline Monitoring System
24/7 real-time inline monitoring of DI water resistivity and flow rate strictly controls rinsing water quality standards. It effectively avoids secondary pollution of large die sizes and low standoff heights SIP modules and guarantees ultra-high surface cleanliness.
9. Super Long Adjustable DI Water Rinse Section
Upgraded super-long DI water rinse section with adjustable spray pressure and angle realizes multi-stage intensive rinsing. It thoroughly flushes residual chemicals and fine impurities from large-size low standoff heights SIP modules, ensuring flawless packaging surfaces.
10. Automatic Chemical & Water Leakage Monitoring System
Full-process intelligent monitoring for chemical liquid and water leakage with real-time fault alarm and safety protection. It effectively prevents equipment failure and workshop safety hazards, ensuring stable and safe long-term operation of the production line.
11. Optional Chemical Concentration Real-Time Detection & Auto Compensation
The optional intelligent module supports real-time detection and automatic compensation of chemical concentration. It keeps cleaning solution concentration stable for a long time.
12. Optional SECS/GEM Software for Smart Factory Integration
Optional SECS/GEM industrial software protocol supports seamless docking with factory MES and automation systems. It realizes remote data monitoring, intelligent data interaction and automated production control, meeting modern smart semiconductor factory construction requirements.
Process Flow Configuration
Certificate
SPERTAR’s factory is certified with ISO9001 standards, and meets the requirements for CE safety certification.
