Why cleaning is critical?
Advanced chip packaging technologies such as SiP, FCBGA, PoP and 2.5D/3D Packaging are driving high-performance computing development, yet they also bring severe flux residue cleaning challenges. Larger dies, more solder bumps and ultra-low standoff heights greatly complicate post-reflow flux removal. With standoff heights decreasing to less than 50μ, outgassing during reflow diminishes, further complicating fux residue removal. Components such as QFNs and LGAs with large thermal pads add to these challenges, risking reliability issues including electrochemical migration and electrical leakage.
Key Features of FC800 Inline Cleaning System
1. Stable & User-Friendly Intelligent Control System
Adopts industrial-grade PC+PLC integrated control with a Windows-based English operation interface, featuring stable operation, simple parameter setting and convenient production line integration, meeting the standardized operation requirements of global semiconductor manufacturing plants.
2. High-Precision Adjustable Chemical Cleaning Module
Designed with a super-long chemical wash section, supporting adjustable chemical spray pressure and angle. Equipped with professional combined spray nozzle kits, specially tailored for low-gap FCBGA, FCCSP, 2.5D and 3D IC chips packaging, realizing comprehensive deep cleaning of tiny gap structures and eliminating residual contaminants thoroughly.
3. Optimized Isolation & Adjustable Air Blow System
Independent chemical isolation section effectively avoids cross-contamination between processes. The air blow section supports adjustable air pressure and blowing angle, which can quickly remove residual chemical liquid and surface particles to ensure clean and dry chip surfaces.
4. Automatic Chemical Management & Cost Reduction Design
Built-in chemical auto add and drain device realizes unmanned automatic fluid management. The exclusive chemical vapor cooling and recovery system recycles waste chemicals effectively, greatly reducing chemical consumption and long-term production operating costs for packaging factories.
5. Constant Temperature Cleaning & Strict Water Quality Monitoring
Independent chemical temperature cooling system keeps the cleaning solution at a constant optimal temperature to ensure consistent and stable cleaning quality in batch production. The inline DI water resistivity and flow rate monitoring system strictly controls rinsing water quality to prevent secondary pollution of chips.
6. High-Efficiency Adjustable DI Water Rinsing System
Equipped with an extended long rinse section, with adjustable DI water spray pressure and angle. It thoroughly rinses residual chemicals on the surface and gaps of advanced packaging chips, ensuring ultra-clean finished products.
7. Full-Coverage Safety Monitoring System
Comes with an automatic chemical and water leakage monitoring system, with real-time fault detection and safety alarm functions, effectively protecting workshop equipment and production safety, and reducing downtime risks.
8. Customizable Intelligent Upgrade Functions
Optional real-time chemical concentration detection and auto compensation function maintains stable cleaning solution concentration, improving batch cleaning consistency and product yield. Optional SECS/GEM software supports seamless connection with factory MES systems, realizing intelligent automated production for smart factories.
Process Flow Configuration
Certificate
SPERTAR’s factory is certified with ISO9001 standards, and meets the requirements for CE safety certification.
